System and method for testing thermal conductivity of thin film materials based on machine learning

A thin film material and thermal conductivity technology, applied in the field of machine learning-based thin film material thermal conductivity test system, can solve the problems of time-consuming and laborious, large test error, inaccurate results, etc., achieve accurate prediction value, avoid manpower and time costs, The effect of precise thermal conductivity and interface thermal resistance

Active Publication Date: 2020-01-21
ZHEJIANG UNIV
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AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the problems of time-consuming and labor-intensive testing methods, large testing errors and inaccurate results

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  • System and method for testing thermal conductivity of thin film materials based on machine learning

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Embodiment Construction

[0029] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0030] Such as figure 1 As shown, the steady-state testing system of deformation-corrected thin film material thermal conductivity and interface thermal resistance based on artificial intelligence and machine learning of the present invention includes a pressure loading terminal, a deformation testing terminal, a surface scanning terminal, a material scanning terminal, and an external environment Analog end, infrared temperature detection end, cloud computing learning end, data output end, result feedback correction end.

[0031] First, according to the actual use conditions of the submicron or nanometer thin film material, the submicron or nanometer thin film material is pressurized through the precision hydraulic device at the pressure...

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Abstract

The invention discloses a system and method for testing thermal conductivity of thin film materials based on machine learning, and the system comprises a pressure loading end, a deformation testing end, a surface scanning end, a material scanning end, an external environment simulation end, an infrared temperature detection end, a could computing learning end, a data output end and a result feedback correction end. The method provided by the invention firstly preprocesses submicron or nanometer thin film materials by means of pressurization, thickness measurement, surface topography and element composition analysis, simulation of temperature and humidity conditions of the application environment, and accurate infrared temperature measurement to obtain basic condition parameters, receives data through the host of the cloud computing learning end, builds a model by using a method of statistical machine learning to calculate and predict the thermal conductivity coefficients and interfacethermal resistance thereof, monitors the cloud computing learning end in real time, and constantly modifies the prediction model and algorithm to finally obtain the optimal submicron or nano thermal conductivity coefficient and interface thermal resistance prediction results.

Description

technical field [0001] The invention relates to the field of steady-state testing of thermal physical properties of materials, in particular to a machine learning-based testing system and method for thermal conductivity of thin film materials. Background technique [0002] Machine learning is the science of how to use computers to simulate or realize human learning activities. It is one of the most intelligent and cutting-edge research fields in artificial intelligence. Since the 1980s, machine learning, as a way to realize artificial intelligence, has aroused widespread interest in the field of artificial intelligence. of the subject. Machine learning has been applied not only in knowledge-based systems, but also in many fields such as natural language understanding, non-monotonic reasoning, machine vision, pattern recognition, etc. Whether a system has the ability to learn has become a sign of "intelligence". The research of machine learning is mainly divided into two t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20G01N3/12G01B11/16G01B11/06G01B21/30G01Q60/24G01N23/2055
CPCG01B11/06G01B11/16G01B21/30G01N3/12G01N23/2055G01N25/20G01N2203/0019G01N2203/0282G01N2203/0641G01N2203/0682G01Q60/24
Inventor 范利武冯飙涂敬张宇鸿俞自涛
Owner ZHEJIANG UNIV
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