Semiconductor wafer planarization device

Abstract

The invention discloses a semiconductor wafer planarization device. The semiconductor wafer planarization device structurally includes a control board, a device housing, a signal lamp, a work chamberand a flat grinding device. The semiconductor wafer planarization device is characterized in that the flat grinding device is located at the lower end of the side, provided with the signal lamp, of the work chamber and is embedded inside the work chamber, the flat grinding device and the work chamber are fixedly connected in a mechanical welding manner, the signal lamp is perpendicular to the upper end surface of the work chamber and is movably connected to the work chamber, and the device housing and the work chamber are of an integrated structure connected left and right. The semiconductor wafer planarization device has the beneficial effects that through cooperation of a cleaner and a limiting device, the movement trend of flowing water is created by an arc-shaped column, the flow stopping effect provided by a wheel plate of a spiral plate body connected head to tail is used in cooperation to collect waste, remaining waste is hooked through pressing deformation of a cushion block with the changeable shape and transversely-arranged tapetum structures to enter a feeding frame to be circulated, flying waste is not left on the surface to be ground, and the wafer planarization control is ensure to a great extent.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a semiconductor wafer flattening device. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. During the processing, a variety of processing techniques are required to achieve the purpose of use. The flatness control of the wafer is processed by mechanochemical grinding. The flatness is very important for the use of finished products. The current semiconductor wafer planarization equipment usually uses vertical downward pressure to match the flat grinding tool when performing the planarization process. Rotation is powered for grinding work, but has the following drawbacks: [0003] After the surface-to-face contact between the grinding tool and the carrier, the surface of the wafer carrier is easily collapsed after the tool passes through, causing small or powdery particles to fly out. At present, it is...

AI Technical Summary

Problems solved by technology

[0003] After the surface-to-face contact between the grinding tool and the carrier, the surface of the wafer carrier is easily collapsed after the tool passes through, causing small or powdery particles to fly out. At present, it is rinsed with the grinding liquid and the grinding work is carried out at the same time. , but in the process of tool rotation, there is a certain amount of rotational traction and it is easy to involve waste materials, because most of the waste materials are polygonal, and it is easy to scratch the surface of the wafer carrier during the rotation of the tool, thus affecting the surface flatness of the wafer carrier , reducing wafer utilization

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