A manufacturing method to solve the mass production of electromagnetic shielding type rigid-flex board

Abstract

The invention discloses a manufacturing method for mass production of electromagnetic shielding rigid-flexible boards, relates to the technical field of circuit board manufacturing, and solves the technical problem that the protective film is difficult to tear off from the electromagnetic wave shielding film. The method comprises a flexible core board manufacturing step, a low-flow prepreg manufacturing step, a rigid core board manufacturing step, a laminating and laminating synthesis step, and an uncovering step, wherein the rigid core board manufacturing step includes: uncovering the rigid core board A protective film is arranged on the region; in the lamination and lamination synthesis step, the protective film completely covers the electromagnetic wave shielding film on the flexible core board. The invention has strong practicability, high production efficiency and low cost, and can be easily peeled off from the electromagnetic wave shielding film when the cover is uncovered, and can effectively protect the electromagnetic wave shielding film when making the electromagnetic shielding type rigid-flex joint board; it is also applicable Mass production of electromagnetic wave shielding films and rigid-flex boards with various structures.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, more specifically, it relates to a manufacturing method for mass production of electromagnetic shielding rigid-flex boards. Background technique [0002] As the circuit design of rigid-flexible circuit boards becomes more and more complicated, the components used are also increasing, and the noise generated between internal circuits and components and external electromagnetic sound are becoming more and more serious, and the electromagnetic interference formed between each other Seriously affect the signal transmission. In order to shield this electromagnetic radiation interference and ensure the integrity of product signal transmission, a consensus has been formed in the industry that an electromagnetic wave shielding film should be attached to the pure dynamic flexible bending area of ​​the rigid-flex circuit board to solve it. For this electromagnetic shielding rigid-flex ...

AI Technical Summary

Problems solved by technology

The biggest disadvantage of this process is: ①The electromagnetic wave shielding film can only be laminated in a single piece on the pure dynamic flexible bending area covering film in the inner layer of the milling cover window, the lamination operation efficiency is low, and it is not feasible for mass production; ② After the electromagnetic wave shielding film is pasted, since there is a large step height difference between the soft and hard joint area and the pure dynamic flexible bending area of ​​the electromagnetic wave shielding film in the window of the milling cover, special "convex" jigs must be used for lamination , the cost of special fixtures is high, and the production pressing is not easy to control

The biggest disadvantages of this process are: ① When the flexible plate with the electromagnetic wave shielding film, the outer rigid plate, and the middle layer of non-flowing PP are subjected to total pressure, under high temperature and high pressure, the PET protective film on the outer layer of the electromagnetic wave shielding film is easily brittle The PET protective film on the outer layer of the electromagnetic wave shielding film cannot be torn off, resulting in scrapping

Its production efficiency is still low, and it is still not feasible for mass production

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