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Display substrate and preparation method thereof and display device

A display substrate, silicon-based technology, applied in the direction of organic semiconductor devices, electrical components, diodes, etc., can solve the problem of short circuit between cathode and anode

Active Publication Date: 2019-12-24
BOE TECH GRP CO LTD
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0005] The technical problem to be solved by the embodiments of the present invention is to provide a display substrate, its preparation method, and a display device, so as to solve the problem of a short circuit between the cathode and the anode in the preparation process of the existing silicon-based OLED microdisplay.

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  • Display substrate and preparation method thereof and display device
  • Display substrate and preparation method thereof and display device
  • Display substrate and preparation method thereof and display device

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Embodiment Construction

[0062] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined arbitrarily with each other.

[0063] figure 1 It is a structural schematic diagram of an existing silicon-based OLED microdisplay. At present, when OLED is used as a micro-display, the way to achieve full color is to use white light + color film. Such as figure 1 As shown, the main structure of the silicon-based OLED microdisplay includes: a silicon-based substrate, a driving circuit layer, a light emitting structure layer, an encapsulation layer, a color filter layer and a cover plate. Among them, the silicon-based substrate i...

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Abstract

The invention provides a display substrate and a preparation method thereof and a display device. The display substrate comprises a micro-cavity structure layer and a light-emitting structure layer which are arranged in a stacked mode. A reflection electrode is arranged in the micro-cavity structure layer. A groove is formed in the surface of the micro-cavity structure layer. The light-emitting structure layer comprises a first electrode arranged in the groove, and the first electrode is connected with the reflection electrode. According to the invention, because the groove is formed in the micro-cavity structure layer and the first electrode of the light-emitting structure layer is arranged in the groove, the offset between the first electrode and the micro-cavity structure layer is controlled, the problem that a cathode and an anode are short-circuited in the preparation process of an existing silicon-based OLED micro-display is solved, and the surface flatness and uniformity requirements of subsequent evaporation are met.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an organic light-emitting display substrate, a preparation method thereof, and a display device. Background technique [0002] Microdisplays have a broad market application space, and are especially suitable for use in helmet-mounted displays, stereoscopic display mirrors, and eye-type displays. Microdisplay is in the interdisciplinary field of microelectronics technology and optoelectronics technology, involving a wide range of technologies, including optoelectronics, microelectronics, electronic informatics and optics, etc. technical field. Among them, the silicon-based OLED microdisplay, which combines Organic Light Emitting Diode (OLED) technology and Complementary Metal Oxide Semiconductor (CMOS) technology, is a cross-integrated product of the optoelectronics industry and the microelectronics industry. It can not only promote the development of a new generation of micro-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32
CPCH10K59/122H10K59/123H10K59/1213H10K59/80518H10K59/80516H10K59/876H10K59/32H10K59/38H10K59/124H10K2102/3026H10K2102/341H10K2102/351H10K50/814H10K59/1201
Inventor 杨盛际陈小川王辉黄冠达卢鹏程赵云翠谢东妹
Owner BOE TECH GRP CO LTD
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