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Sound field enhanced nanofluid phase change heat transfer micro-channel heat exchanger

A micro-channel heat exchanger and nano-fluid technology, applied in cooling/ventilation/heating transformation, modification using liquid cooling, etc., to achieve the effect of enhancing the heat transfer effect, increasing the speed of bubble movement, and promoting the increase of the number of bubbles

Pending Publication Date: 2019-12-10
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no microchannel heat sink that uses nanofluids and ultrasonic fields to enhance heat transfer at the same time.

Method used

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  • Sound field enhanced nanofluid phase change heat transfer micro-channel heat exchanger
  • Sound field enhanced nanofluid phase change heat transfer micro-channel heat exchanger
  • Sound field enhanced nanofluid phase change heat transfer micro-channel heat exchanger

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Embodiment Construction

[0034] The purpose of the invention of the present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments, and the embodiments cannot be repeated here one by one, but the implementation of the present invention is not therefore limited to the following embodiments.

[0035] Such as Figure 1 to Figure 3 As shown, a sound field enhanced nanofluid phase change heat transfer microchannel heat exchanger includes a heat exchanger substrate 7 with a rectangular groove inside, a microchannel substrate 10 arranged in the rectangular groove of the heat exchanger substrate 7, The cover plate 2 is provided with cover plate fixing bolt holes 21, and the top surface of the heat exchanger base 7 is provided with several cover plate fixing screw holes 73, and the cover plate 2 is sealed and covered on the heat exchanger by several bolts 1. At the opening of the rectangular groove of the base 7, the two ends of the heat excha...

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Abstract

The invention discloses a sound field enhanced nanofluid phase change heat transfer micro-channel heat exchanger. The micro-channel heat exchanger comprises a heat exchanger substrate internally provided with a rectangular groove, a micro-channel base plate arranged in the rectangular groove of the heat exchanger substrate, and a cover plate covering an opening of the rectangular groove of the heat exchanger substrate in a sealed mode through several bolts. Two ends of the heat exchanger substrate are provided with an inlet joint and an outlet joint of inflow and outflow nanofluids. The heat exchanger also comprises at least one ultrasonic transducer component whose pitching angle is adjustably and fixedly arranged in the rectangular groove of the heat exchanger substrate. In the invention, an application of ultrasonic enhanced heat transfer technology to the micro-channel heat exchanger is achieved, an ultrasonic transducer is arranged in heat exchanger and can directly act on a heatexchange working medium, growth and separation of boiling bubbles are promoted, and heat transfer performance of the micro-channel heat exchanger is increased by above 20% in combination with a nanofluid enhanced heat transfer technology compared with that of a common micro-channel heat exchanger.

Description

technical field [0001] The invention relates to the field of heat exchangers, in particular to a sound field enhanced nanofluid phase change heat transfer microchannel heat exchanger with built-in ultrasonic transducers. [0002] technical background [0003] With the rapid development of the capacity and speed of electronic computers and the requirements of missiles, satellites and military radars for high-performance modules and high-reliability and high-power devices, the heat flux of electronic devices has increased dramatically. At the same time, the rapid development of micro / nano technology has also led to the continuous reduction of the component size of each electronic device, which has led to the continuous development of the cooling device to ensure the normal operation of the microelectronic device. The rise and development of micro-scale devices and their cooling devices have put forward higher requirements for enhanced heat transfer technology in tiny spaces. ...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20309
Inventor 罗小平喻凡肖健章金鑫王文廖政标
Owner SOUTH CHINA UNIV OF TECH
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