A kind of electroplating tin solution with good deep plating ability and electroplating method thereof
A technology of electro-tin plating and capacity, which is applied in the field of electro-tin plating solution, which can solve the problems of poor deep-plating capacity, hidden dangers of corrosion on the inner wall of long pipes, and failure to meet the requirements of internal coating of long-tube workpieces, etc., and achieve the effect of improving deep-plating capacity
Active Publication Date: 2021-05-14
粤海中粤(秦皇岛)马口铁工业有限公司
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Problems solved by technology
Although this electroplating solution has the above-mentioned advantages, its deep plating ability is not good enough. In actual electroplating applications, this electroplating solution is not suitable for workpieces with simple shapes such as long tubes, so that the internal coating of long tube workpieces cannot meet the requirements, resulting in Serious quality problems and hidden dangers of corrosion on the inner wall of long pipes
Method used
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Embodiment 1
[0018] An electroplating tin solution with good deep plating ability is characterized in that it is prepared from the following raw materials: 200ml / L of stannous methanesulfonate, 100ml / L of 70wt% methanesulfonic acid, 20g / L of isopropanol, ten Dialkyl sodium sulfate 5g / L, p-methoxyphenol 2g / L, quercetin 0.03g / L, 6-phenyl-2-thiouracil 0.1g / L, malic acid 0.3g / L.
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Abstract
The invention discloses an electroplating tin solution with good deep plating ability, which is characterized in that it is prepared from the following raw materials: stannous methanesulfonate 100ml / L-300ml / L, methanesulfonic acid 70wt% 75ml / L- 150ml / L, isopropanol 10g / L~30g / L, sodium lauryl sulfate 1g / L~10g / L, p-methoxyphenol 0.5g / L~3g / L, quercetin 0.02g / L ~0.05g / L, 6‑phenyl‑2‑thiouracil 0.1g / L~0.2g / L, malic acid 0.2g / L~0.5g / L. The beneficial effect of the invention is that the deep-plating ability of the electroplating solution is greatly improved, it is very suitable for the plating of long tube-shaped workpieces, and the long-standing difficult technical problems in the prior art are solved.
Description
technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating tin solution with good deep plating ability and an electroplating method thereof. Background technique [0002] Due to the emphasis on light, thin, short and small HDI era has become the mainstream of the PCB industry. In the electroplating process, the requirements and standards for deep blind hole and high aspect ratio through hole electroplating, better coating quality and board surface uniformity, etc., have now become important and key influences, among which deep plating ability is an item of electroplating Key indicators, especially important for the production of circuit boards. Deep plating ability is also called coverage ability. The method commonly used in my country is the tubular inner hole method. This method is to take a copper tube with an aperture of 10mm and a length of 100mm. As for the rectangular test tank equipped with the plating ...
Claims
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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/32C25D7/04
CPCC25D3/32C25D7/04
Inventor 王冬生
Owner 粤海中粤(秦皇岛)马口铁工业有限公司
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