Heat dissipation structure and electronic device having the heat dissipation structure

A heat dissipation structure and electronic device technology, which is applied in the direction of electrical components, electrical equipment structural parts, cooling/ventilation/heating transformation, etc., can solve the problems of high cost and complicated process of ultra-thin heat pipes, and achieve low production cost and high heat dissipation effect Good, simple process effect

Active Publication Date: 2021-06-29
SHENZHEN FUTAIHONG PRECISION IND CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the manufacturing process of ultra-thin heat pipes is complex and expensive

Method used

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  • Heat dissipation structure and electronic device having the heat dissipation structure
  • Heat dissipation structure and electronic device having the heat dissipation structure

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Embodiment Construction

[0013] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0014] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be intervening elements at the same time. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.

[0015] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as co...

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Abstract

A heat dissipation structure, comprising a housing, a capillary structure and a heat dissipation liquid, the housing is sealed to form a cavity, the capillary structure and the heat dissipation liquid are accommodated in the cavity, and the heat dissipation liquid is used to pass through The heat is absorbed by the phase change during evaporation and the heat is dissipated through the diffusion and condensation of the evaporated gas. The capillary structure is used to guide the diffusion and condensation of the cooling liquid back to the previous evaporation position. The invention also provides an electronic device with a heat dissipation structure.

Description

technical field [0001] The invention relates to a heat dissipation mechanism and an electronic device with the heat dissipation structure. Background technique [0002] At present, ultra-thin heat pipes are widely used in electronic devices for better heat dissipation. However, the manufacturing process of the ultra-thin heat pipe is complex and expensive. Contents of the invention [0003] In view of this, it is necessary to provide a heat dissipation structure with simple manufacturing process. [0004] The invention also provides an electronic device with the heat dissipation structure. [0005] A heat dissipation structure, comprising a housing, a capillary structure and a heat dissipation liquid, the housing is sealed to form a cavity, the capillary structure and the heat dissipation liquid are accommodated in the cavity, and the heat dissipation liquid is used to pass through The heat is absorbed by the phase change during evaporation and the heat is dissipated th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/2029H05K7/20336
Inventor 张育维
Owner SHENZHEN FUTAIHONG PRECISION IND CO LTD
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