Automatic adhesive tape pasting equipment

Abstract

The invention provides a piece of automatic adhesive tape pasting equipment, which relates to the technical field of chip production. The equipment includes a frame, clamps used to carry semi-finishedchips, a pair of conveying mechanisms used to intermittently convey the clamps and an adhesive tape pasting mechanism used to paste adhesive tapes onto the pins of the semi-finished chips. The conveying mechanisms are installed in parallel on the frame. The adhesive tape pasting mechanism can be connected to the frame by sliding along the conveying direction of the conveying mechanisms and is located above the conveying mechanisms. The equipment is reasonable in design, can automatically paste adhesive tapes onto chip pins and avoid manual input, and has high pasting efficiency and excellentand stable pasting quality.

Description

technical field [0001] The invention relates to the technical field of chip production, in particular to an automatic tape sticking device. Background technique [0002] The production of semi-finished chips is mostly molded, and the formed semi-finished chips are connected into a row of plates, and the adjacent semi-finished chips need to be separated by cutting equipment to obtain a single semi-finished chip, so as to facilitate the processing of the subsequent process; and in this process It is easy to cause damage such as bending of the pin pins of the chip. In order to avoid damage to the pin pins, the pin pins of the chip need to be pasted and protected with tape before cutting the material. Now most of them use manual methods to paste the tape, which is inefficient. And the paste quality varies. Contents of the invention [0003] The object of the present invention is to provide an automatic tape sticking device, which can automatically stick tape on chip pins, avo...

AI Technical Summary

Problems solved by technology

[0002] The production of semi-finished chips is mostly molded, and the formed semi-finished chips are connected into a row of plates, and the adjacent semi-finished chips need to be separated by cutting equipment to obtain a single semi-finished chip, so as to facilitate the processing of the subsequent process; and in this process It is easy to cause damage such as bending of the pin pins of the chip. In order to avoid damage to the pin pins, the pin pins of the chip need to be pasted with tape to protect them before the chip cutting operation. Now most of them use manual methods to paste the tape, which is inefficient. And the paste quality is different

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