Method for increasing PAD test coupon module in PCB inner layer angle

Abstract

The invention relates to the technical field of PCB circuit boards, and discloses a method for increasing a PAD test coupon module in a PCB inner layer angle. The method comprises the following stepsof: making reasonable design for a circuit on the PCB, marking detailed and real specific figures for pin sizes and structure sealing forms of all the elements in the electronic manufacturing when thecircuit board is designed, wherein It should be noted that elements in the same model can be different on the value and the pin arrangement due to the production factories sometimes; according to thedesigned electrical schematic diagram, simulating the element total frame graph. The method provided by the invention adds the patterns of a bonding pad test coupon module, designs and adds the corresponding drilling program on the drilling data so that an X-RAY machine is only used to check whether the hole deviation condition of a board angle registration hole meets the standard requirement ornot so as to achieve the simple, convenient and rapid and efficient detection mode, greatly reduce the inspection difficulty and improve the inspection efficiency.

Description

Technical field [0001] The invention relates to the technical field of PCB circuit boards, in particular to a method for adding a PAD test coupon module to the corners of the inner layer of the PCB circuit board. Background technique [0002] Circuit board PCB is the abbreviation of printed PCB and circuit board. Usually, the conductive pattern made of printed circuits, printed components or a combination of the two is called printed circuit according to a predetermined design on the insulating material. The conductive pattern that provides the electrical connection between the components on the material is called a printed circuit. In this way, the printed circuit or the finished board of the printed circuit is called a printed circuit board, also called a printed board or a printed circuit board , Circuit boards can be divided into surface circuit boards, double-sided circuit boards, multilayer circuit boards, aluminum-based circuit boards, impedance circuit boards and FPC flex...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a method for increasing the PAD test coupon module at the inner layer of the PCB circuit board, which has the ability to reduce batch abnormality and scrap caused by PCB batch hole deviation, abnormal expansion and contraction and lamination misalignment defects Advantages, it solves the problem of abnormal expansion and contraction, lamination misalignment or wrong drill tape change, etc., and the first piece of drilling will have poor hole deviation, resulting in the scrapping of the PCS board or the scrapping of the entire PNL