A Diamond Wire Broken Online Detection System

Abstract

The invention provides an online detection system for diamond wire breakage, which includes a current pick-up unit, a signal acquisition unit, an arithmetic processing unit, and a signal output unit. In view of the characteristics of the diamond wire as a dielectric, the current is generated by means of additional power excitation, and because the current value passing through the diamond wire varies greatly and fluctuates significantly under different working conditions, an accurate judgment can be made on the working state of the diamond wire. For current values ​​in different ranges, the current pick-up unit is divided into two pick-up circuits: a Hall current sensor and a single-supply amplifier. The operation processing unit adopts an embedded chip with a high clock frequency, and embeds a preset operation program to realize high-speed state acquisition and online disconnection recognition operation. The signal output unit outputs alarm and shutdown signals in time after the calculation processing part determines that the diamond wire is broken. Each part performs its own duties and cooperates with each other.

Description

technical field [0001] The invention relates to the technical field of silicon wafer cutting, in particular to a wire break detection device used on diamond wire slicer equipment in the production process of solar cell modules. Background technique [0002] In the production process of solar cell modules, slicing the raw material monocrystalline silicon is an essential step. At present, the slicing operation mainly uses a multi-wire cutting machine, and its processing methods mainly include free abrasive wire saw cutting and fixed abrasive cutting. Free abrasive cutting is to bring the abrasive grains in the slurry into the cutting area through a thin steel wire at a certain speed to achieve the purpose of cutting materials; the fixed abrasive cutting method is to use electroplating and resin bonding to attach diamond abrasive grains to the cutting area. The diamond wire is made on the wire, and the diamond wire is pulled by the guide wheel to reciprocate at a high speed to...

AI Technical Summary

Problems solved by technology

[0003] During the cutting process of cutting silicon wafers with diamond wire, due to the influence of unbalanced friction, uneven tension of the cutting wire, and uncoordinated control of the feeding speed of the silicon wafer and the speed of the cutting wire, the problem of cutting wire breakage will occur. , once the wire is broken, the slicer needs to alarm and stop in time, otherwise, it will lead to waste of silicon rods, and cause the cutting wire network to be evacuated, seriously affecting production efficiency

[0004] In the prior art, the device for detecting broken wires and alarming is mainly to set the cutting wire network with low-voltage electricity, and the cutting wire ends after the wires are broken will swing as the wire roller motor continues to work. touch, it will cause a short circuit alarm

However, this wire break detection device is not accurate. After the diamond wire breaks, the wire end may be wound on the main roller and cannot touch the alarm rod; Movement, high temperature and high heat are generated, and the site cools down by spraying cooling water on it. In this water-containing cutting environment, the above-mentioned alarm method will have overall electrical conduction, which will make the grounding alarm rod invalid, and cannot accurately detect wire breakage. Cause equipment downtime or even accidents

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