Hybrid integrated circuit tube shell and method for preventing glass insulator from breaking

Abstract

The invention belongs to the technical field of electronic packaging, and relates to a hybrid integrated circuit tube shell. The hybrid integrated circuit tube shell comprises a tube shell side wall and a plurality of insulator mounting holes embedded in the tube shell side wall, wherein the insulator mounting holes are internally equipped with insulators; and the pressure-bearing end parts of thetube shell side wall are respectively provided with elastic stress strips. The method for preventing a glass insulator from breaking comprises the steps of arranging elastic stress strips at the pressure-bearing end parts of the tube shell side wall of the circuit tube shell, pressing the pressure-bearing end parts of the tube shell side wall to a circuit board provided with the circuit tube shell when the circuit tube shell is installed, and enabling the elastic stress strips to generate elastic deformation and bear elastic stress; and maintaining the elastic stress of the elastic stress trips and packaging the circuit tube shell. The method can protect the glass insulator from being broken due to the deformation of the tube shell side wall while not reducing the internal space of the integrated circuit tube shell, and has the advantages of low operating and processing difficulty and obvious effect.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging, and relates to a hybrid integrated circuit shell and a method for preventing glass insulators from breaking. Background technique [0002] The integrated circuit shell is an important part of the hybrid integrated circuit. It mainly plays the role of circuit support, electrical signal transmission, heat dissipation, sealing and protection. The shallow-cavity integrated circuit shell is the most commonly used shell type for hybrid integrated circuits. Nearly With the continuous improvement of circuit density in recent years, circuit design has put forward higher requirements for shallow-cavity integrated circuit shells, but the traditional shell structure design is difficult to meet the requirements of circuit design. The main problems are as follows: In order to increase circuit density, The circuit design needs to lay more circuits inside the shell under the condition of constant le...

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Problems solved by technology

[0002] The integrated circuit shell is an important part of the hybrid integrated circuit. It mainly plays the role of circuit support, electrical signal transmission, heat dissipation, sealing and protection. The shallow-cavity integrated circuit shell is the most commonly used shell type for hybrid integrated circuits. Nearly With the continuous improvement of circuit density in recent years, circuit design has put forward higher requirements for shallow-cavity integrated circuit shells, but the traditional shell structure design is difficult to meet the requirements of circuit design. The main problems are as follows: In order to increase circuit density, The circuit design needs to lay more circuits inside the shell under the condition of constant length, width and height, and add more input and output electrical signal connections on the shell, but increase the input and output electrical signal connection leads of the integrated circuit shell. (abbreviation: outer lead), will inevitably lead to the reduction of the strength of the side wall of the integrated circuit case. When the strength of the side wall of the case is reduced, there will be a large mechanical stress during the subsequent circuit sealing package and test process. This stress will Cause the deformation of the side wall of the tube shell, because the side wall of the tube shell is embedded with glass insulators, so once the deformation stress of the metal side wall around the glass insulator is greater than the strength of the glass insulator, it will cause cracks in the glass insulator, resulting in seal failure, which means that the seal failure means end-of-life

In order to solve this problem, designers usually strengthen the strength of the side wall of the shell by increasing the thickness of the side wall of the shell, that is, by enhancing the stress resistance of the side wall of the shell to resist the packaging stress, but increasing the thickness of the side wall of the shell It will reduce the space inside the integrated circuit shell, which in turn makes it more difficult to increase the circuit density.

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