A fingerprint identification module and an electronic device

Abstract

The present application provides a fingerprint identification module and an electronic device to improve the performance and structural reliability of the fingerprint identification module. The fingerprint identification module includes a flexible circuit board, a substrate, a fingerprint identification chip, and a filling glue layer, wherein: the flexible circuit board is laminated with the substrate and includes a first end and a second end opposite to each other, and the first end and the second end At least one end of the flexible circuit board is beyond the substrate, and an outlet area is formed on the flexible circuit board close to the end beyond the substrate; the first surface of the substrate facing the flexible circuit board includes a first area and a second area, and the first area is provided with wiring and for connecting with the flexible circuit board. The soldering pad for the electrical connection of the flexible circuit board, the second area is opposite to the outlet area and is provided with a slot; the fingerprint identification chip is arranged on the second surface of the substrate facing away from the flexible circuit board; the filling glue layer is filled between the flexible circuit board and the substrate space for wrapping pads.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, in particular to a fingerprint identification module and an electronic equipment. Background technique [0002] With the continuous advancement of the full-screen design of mobile phones, the fingerprint recognition area of ​​the mobile phone is gradually shifted from the side of the mobile phone screen to the back side or peripheral side of the mobile phone. In this way, it is necessary to set an installation slot on the back shell or middle frame of the mobile phone to accommodate fingerprints. Identify mods. The fingerprint identification module usually includes a flexible circuit board, a substrate, a fingerprint identification chip, and a filling glue layer. Connected pads, the fingerprint identification chip is arranged on the second surface of the substrate facing away from the flexible circuit board and forms an integrated packaging structure with the substrate, an...

AI Technical Summary

Problems solved by technology

With this design, when forming the glue filling layer, it is necessary to dispense glue on the first surface of the substrate along the extending direction of the edge of the flexible circuit board, so that the glue can be filled between the flexible circuit board and the substrate by capillary action. When it is full, the glue may overflow to the side of the package structure composed of the substrate and the fingerprint identification chip, resulting in an increase in the overall size of the fingerprint identification module, which will interfere with the middle frame when installed in the installation slot

In order to avoid the above problems, the amount of glue dispensing in the existing fingerprint identification modules is generally insufficient, and the insufficient amount of glue dispensing will lead to poor sealing around the pads. Under normal circumstances, the sweat on the fingers easily invades between the flexible circuit board and the substrate and causes corrosion to the pad, which affects the performance of the fingerprint recognition module

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