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Metallic micro component pickup method based on electrochemical deposition

A technology for depositing metal and micro-components, applied in the directions of manipulators, hand-held tools, chucks, etc., can solve the problems of picking up and damage of metal micro-components, and achieve the effects of low preparation cost, short preparation cycle and small volume

Active Publication Date: 2019-10-11
严格科创产业发展集团合肥有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to solve the problem that the existing metal micro-components are easily damaged or dropped when picking up, the present invention proposes a metal micro-component picking method based on electrochemical deposition

Method used

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  • Metallic micro component pickup method based on electrochemical deposition
  • Metallic micro component pickup method based on electrochemical deposition
  • Metallic micro component pickup method based on electrochemical deposition

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Embodiment Construction

[0055] In order to make the purpose, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0056] combine figure 1 and figure 2 Note that the metal micro-component in this embodiment is a micro-copper wire, the length of the micro-copper wire is 400 μm, and the radius is 20 μm. The electrolyte used in this embodiment has a concentration of 200mol / m 3 copper sulfate solution;

[0057] In this embodiment, the pick-up method of metal micro-components based on electrochemical deposition is carried out according to the following steps:

[0058] Step 1: Calculate the minimum nozzle radius r that can successfully pick up the required pipette according to the stress conditions of the mi...

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Abstract

The invention discloses a metallic micro component pickup method based on electrochemical deposition, relates to the metallic micro component pickup method, and aims to solve the problem that an existing metallic micro component is difficult to pick up and prone to damage. The pickup method comprises the following steps of calculating the minimum nozzle radius of a pipette capable of successfullypicking up according to stress conditions of a pick-up object and selecting a pipette; and calculating steady-state current, deposition height and deposition time, and then switching on a power supplyfor pick-up. According to the metallic micro component pickup method, when metallic micro components are required to pick up, the adopted pipette is small in size, and can pick up the metallic microcomponents of various types so that have application in producing complex micro electro mechanical system, and meanwhile the metallic micro components are not damaged when being picked up. The methodis suitable for picking up metallic micro components.

Description

technical field [0001] The invention relates to a method for picking up metal micro components. Background technique [0002] Metal micro-components refer to micron-scale components, and the more common ones are wire-shaped metal micro-components, such as micro-copper wires. When assembling metal micro-components, it is generally necessary to use tools to pick them up. After picking up, the micro-components are required to be flipped, moved or aligned with the tool, and the micro-components must not be dropped or damaged during the operation. [0003] The existing pick-up method is to use mechanical operating tools such as micro tweezers to clamp the operating object to achieve movement, but the micro-components are small in size, and the mechanical operating tools are relatively large in size. It is easy to cause irreversible damage to the micro-components, and the drop of the micro-components is easy to occur. Therefore, the existing mechanical operating tools can only r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B25B27/00B25J15/00
CPCB25B27/00B25J15/008
Inventor 李东洁许吉勇俞敏峰荣伟彬杨柳
Owner 严格科创产业发展集团合肥有限公司
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