Glass substrate cutting machine

Abstract

The present disclosure relates to a glass substrate cutting machine. The glass substrate cutting machine comprises a heating device (1) and driving devices (2), the heating device (1) is used for heating the cutting zone of a glass substrate (5), and the driving devices (2) are used for driving the heating device (1) to move in a direction close to or away from the cutting zone. The driving devices (2) drive the heating device (1) to get close to or away from the glass substrate (5) to heat the cutting zone, so the overall temperature of the cutting zone keeps uniform, dust aggregation caused by uneven temperature of the cutting zone during cutting is prevented, and the dusts are avoided from adhering to the surface of the glass substrate (5), thereby the quality of the glass substrate (5) is improved, the wearing of a cutting blade (6) is reduced, and the service life of the cutting blade (6) is prolonged.

Description

technical field [0001] The present disclosure relates to the technical field of glass substrates, in particular, to a glass substrate cutting machine. Background technique [0002] In the production process of liquid crystal glass substrates, the molten glass frit is overflowed and drawn into plates, and then cut into individual pieces by a cutting machine. In the prior art, the cutting knife directly cuts the annealed glass substrate. At this time, the cutting area of ​​the glass substrate presents a temperature distribution with low temperature at both ends and high temperature in the middle. Accumulated at the transition position between them, resulting in a large amount of glass dust attached to the surface of the glass substrate, and the attached glass dust cannot be eliminated in the subsequent cleaning and dust removal process of the glass substrate, seriously affecting the quality of the glass substrate. In addition, when the cutting knife cuts when the temperature ...

AI Technical Summary

Problems solved by technology

In the prior art, the cutting knife directly cuts the annealed glass substrate. At this time, the cutting area of ​​the glass substrate presents a temperature distribution with low temperature at both ends and high temperature in the middle. Accumulated at the transition position between them, resulting in a large amount of glass dust attached to the surface of the glass substrate, and the attached glass dust cannot be eliminated in the subsequent cleaning and dust removal process of the glass substrate, seriously affecting the quality of the glass substrate

In addition, when the cutting knife cuts when the temperature in the cutting area is not uniform, it will also cause greater wear to the cutter wheel of the cutting knife, thus affecting the service life of the cutting knife

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