A gluing process for the manufacture of copper clad laminates

A technology of copper clad laminate and gluing, applied in papermaking, textile and papermaking, fiber raw material processing and other directions, can solve the problems of uneven distribution of glue, curing, affecting the gluing efficiency of substrates, etc. The effect of the amount of glue

Active Publication Date: 2021-05-28
安能电子有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above problems, the present invention provides a gluing process for the manufacture of copper clad laminates, which can solve the problem that when gluing, since the amount of gluing on the base material of the present invention is small, the rotating drive roller only needs to apply a small amount of gluing. However, since the resin glue is fluid, it is difficult for the glue to adhere to the surface of the drive roller, which may cause some of the surface of the drive roller to fail to adhere to the resin glue, and the glue distribution is not good. Uniformity, so that some substrates cannot be glued, and the resin glue is fluid after being heated. Due to the low surface temperature of the drive roller, when the surface of the drive roller contacts the resin glue, part of the resin solution may be cured. Thus affecting the gluing efficiency of the substrate and other issues

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A gluing process for the manufacture of copper clad laminates
  • A gluing process for the manufacture of copper clad laminates
  • A gluing process for the manufacture of copper clad laminates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0039] Such as Figure 1 to Figure 8 As shown, a gluing process for the manufacture of copper clad laminates, the specific gluing method steps are as follows:

[0040] S1. Glue dispensing: select phenol and formaldehyde as raw materials and put them into the gluing tank, add catalysts to react and synthesize phenolic resin glue, the gluing tank is a frame structure with an upper end open and a lower end closed;

[0041] S2. Installation: install the fixed frame 1 on the rear end of the glue tank through the connector, and immerse the lower end surface of the rubber roller 2 on the f...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a gluing process for the manufacture of copper-clad laminates. The operation is completed by the cooperation of a fixed frame, a rubber roller, a gluing roller and a dispersion device. The amount of glue is small, so the rotating drive roller only needs to bring a small amount of glue to the surface of the drive roller, but because the resin glue is fluid, it is difficult for the glue to adhere to the surface of the drive roller, which may cause partial transmission The surface of the roller fails to adhere to the resin glue, and the glue is not evenly distributed, so that part of the substrate cannot be glued. The resin glue is fluid after being heated. Due to the low surface temperature of the drive roller, when the drive roller When the surface is in contact with the resin glue solution, part of the resin solution may be cured, which affects the gluing efficiency of the substrate and other issues.

Description

technical field [0001] The invention relates to the field of manufacturing copper-clad laminates, in particular to a gluing process for manufacturing copper-clad laminates. Background technique [0002] Copper-clad laminate refers to substrates such as paper and glass fiber cloth, which are impregnated with resin to make bonding sheets. After combining several bonding sheets, copper foil is placed on one or both sides, and the board is cured by hot pressing. Shaped product, used as the basic material of PCB, the gluing process needs to be carried out in the copper clad laminate manufacturing process, the present invention dips the base material through the contact method, and the glue is transported by two transmission rollers during gluing, so that when gluing The amount of glue applied to the surface of the base material is small. Due to the small amount of glue when gluing, the following problems are often encountered during the gluing process: [0003] 1. Since the pres...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): D21H23/56
CPCD21H23/56
Inventor 张小闯李海波李梦然
Owner 安能电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap