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Laser cutting method

A laser cutting and laser beam technology, applied in laser welding equipment, welding/cutting auxiliary equipment, auxiliary welding equipment, etc., can solve the problems of easy generation of debris, increase cost, increase process, etc., achieve uniform thermal stress and improve yield , to avoid the effect of fragmentation

Active Publication Date: 2019-09-06
SHENZHENSHI YUZHAN PRECISION TECH CO LTD
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  • Application Information

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Problems solved by technology

However, the above-mentioned cut glass workpieces are prone to edge chipping, and the edge strength of the glass workpiece is weak, and subsequent CNC cutting processing is required, which increases the process and increases the cost.
At the same time, the laser is used to process glass workpieces, the process is complex and fragments are prone to occur during the slitting process, which reduces the processing yield

Method used

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  • Laser cutting method
  • Laser cutting method
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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] It should be noted that when an element or component is considered to be “connected” to another element or component, it may be directly connected to the other element or component or there may be an intervening element or component at the same time. When an element or component is referred to as being "disposed on" another element or component, it can be directly disposed on the other element or component or intervening elements or compone...

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Abstract

The invention provides a laser cutting method which comprises the following steps of providing a laser cutting device. The laser cutting device comprises a machine table, a conveying mechanism, a cutting mechanism, a standing mechanism and a splitting mechanism, wherein the cutting mechanism comprises a moving platform and a laser cutter; the splitting mechanism comprises a fixed jig and at leastone heating laser; the conveying mechanism takes and places a workpiece onto the moving platform; the laser cutter emits a laser beam to precut the workpiece located on the moving platform and forms aprecutting line; the conveying mechanism takes and places the precut workpiece onto the standing mechanism from the moving platform, and the precut workpiece is stood for a preset time; the conveyingmechanism takes and places the stood workpiece onto the fixed jig from the standing mechanism; and each heating laser is used for emitting a laser beam to heat the workpiece located on the fixed jigalong the precutting line, so that the workpiece is split under the impact of a heat stress along the precutting line so as to be cut. The laser cutting method has high cutting yield.

Description

technical field [0001] The invention relates to a cutting method, in particular to a laser cutting method for cutting glass workpieces. Background technique [0002] Existing glass cutting equipment mainly adopts traditional glass cutters to cut workpieces. However, the above-mentioned cut glass workpiece is prone to edge chipping, and the edge strength of the glass workpiece is weak, and subsequent CNC cutting processing is required, which increases the manufacturing process and increases the cost. At the same time, the laser is used to process glass workpieces. The process is complex and fragments are prone to occur during the slitting process, which reduces the processing yield. Contents of the invention [0003] In view of the above situation, it is necessary to provide a laser cutting method with high cutting yield. [0004] A kind of laser cutting method, it comprises the following steps: [0005] A laser cutting device is provided, the laser cutting device includ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/70B23K37/04
CPCB23K26/38B23K37/0435B23K26/702
Inventor 王有德杨关伟张红岩丁培
Owner SHENZHENSHI YUZHAN PRECISION TECH CO LTD
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