Production process of multilayer circuit board

Abstract

The invention provides a production process of a multilayer circuit board. The production process comprises the following steps: S1 feeding, S2 inner layer, S3 primary pressing, S4 primary drilling, S5 primary electroplating, S6 resin hole plugging, S7 abrasive belt grinding, S8 primary film drying, S9 primary etching, S10 secondary pressing, S11 secondary drilling, S12 secondary electroplating, S13 secondary film drying, S14 secondary etching, S15 solder prevention, S16 gold formation and S17 scooping. The production process of the multilayer circuit board is suitable for manufacturing the multilayer circuit board with simple steps, high processing efficiency and high product quality.

Description

technical field [0001] The invention relates to the field of multilayer circuit board processing, in particular to a production process of a multilayer circuit board. Background technique [0002] A circuit board, also known as a printed circuit board, is the provider of electrical connections for electronic components. Its development has a history of more than 100 years, and its design is mainly layout design. The main advantage of using circuit boards is that it greatly reduces wiring and assembly errors, and improves the automation level and production labor rate. According to the number of layers of circuit boards, printed circuit boards can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. [0003] For multi-layer circuit boards, the traditional production methods are: cutting, inner layer, lamination, drilling, electroplating, dry film, etching, solder mask, fishing, cutting. Set the a...

AI Technical Summary

Problems solved by technology

Set the abscissa as X, the ordinate as Y, and the coefficient of the standard specification is X=Y=100%. Since the circuit board is pressed, the circuit layer will shrink, and the shrinkage coefficient is X=Y=99.98~99.99%. For circuit boards with high precision and high wiring, the wiring accuracy is seriously affected; in addition, the surface of the etched circuit board is generally coated with a solder mask, usually using a tin layer, but in the traditional process, in order to improve processing efficiency, the etching Immediately after the completion, the surface is printed with paint for anti-soldering. Since the paint needs to be baked and solidified, the paint film will bulge after the position of the buried hole or blind buried hole is cooled, and there will be a lot of air bubbles.