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Semiconductor equipment front-end module, semiconductor equipment and wafer processing method

A technology of equipment front-end modules and processing methods, which is applied in semiconductor/solid-state device manufacturing, electrical components, conveyor objects, etc., can solve problems such as bad chips, increased production costs, and decreased product yield, so as to reduce production costs and improve Production yield and the effect of improving cleanliness

Active Publication Date: 2021-07-23
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above-mentioned shortcoming of prior art, the object of the present invention is to provide a kind of semiconductor equipment front-end module, semiconductor equipment and wafer processing method, be used to solve the front opening wafer box (FOUP) that is in standby in the prior art ) is always in the open state, causing the wafer to be polluted, causing various process defects such as unetch or unashing (Unashing) and causing chip failure, resulting in a decline in product yield and ultimately an increase in production costs.

Method used

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  • Semiconductor equipment front-end module, semiconductor equipment and wafer processing method
  • Semiconductor equipment front-end module, semiconductor equipment and wafer processing method
  • Semiconductor equipment front-end module, semiconductor equipment and wafer processing method

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Embodiment 1

[0060] Such as Figure 1 to Figure 4 As shown, the present invention provides a semiconductor device front-end module 1 . The front-end module 1 of the semiconductor equipment is connected with the reaction chamber module 2 for processing the wafer to be processed. The front-end module 1 of the semiconductor equipment includes a buffer chamber 13, at least two wafer loading ports 11, at least one Mechanical arm 12, box opening device 15 and control device 16. Wherein, the buffer chamber 13 has a top wall 131, a front wall 132, a rear wall 133, a first side wall 134 and a second side wall 135, the top wall 131 is connected to the front wall 132, the rear wall 133, the second side wall 135 The side wall 134 and the second side wall 135 are connected to form a closed space of the buffer chamber 13, wherein the front wall 132 is connected to the reaction chamber module 2 via the load lock module 3; the wafer The loading port 11 is located in the buffer chamber 13 and at least on...

Embodiment 2

[0068] Such as Figure 5As shown, the present invention also provides a semiconductor device for processing the wafer to be processed. The semiconductor equipment includes a reaction chamber module 2 and the front-end module 1 of the semiconductor equipment in Embodiment 1. The front-end module 1 of the semiconductor equipment is connected to the reaction chamber module 2 via the load-lock module 3 for The wafer to be processed is transferred into the reaction chamber module 2 , and the processed wafer is removed from the reaction chamber module 2 . The reaction chamber module 2 includes at least one reaction chamber 21 . It should be noted that, in the case of only one reaction chamber, the reaction chamber module 2 can be regarded as one reaction chamber 21 . Of course, in order to make full use of the space in the clean room, generally there are multiple reaction chambers 21, such as 3, 4, 5 or even more. According to different needs and different equipment structures, t...

Embodiment 3

[0072] see Figure 7 , the present invention also provides a wafer processing method, the wafer processing method is carried out using the semiconductor equipment front-end module 1 as in Embodiment 1, and the wafer processing method includes:

[0073] Step S1, loading at least two front-end wafer cassettes 14 loaded with wafers to be processed on the wafer loading port 11 of the semiconductor equipment front-end module 1, wherein the semiconductor equipment front-end module 1 is used to use different described The FOUP cassettes 14 are placed in the working state and the standby state respectively, and when one of the FOUP cassettes 14 is in the working state, the other FOUPs 14 are in the standby state, so as to deal with different The wafers to be processed in the front open wafer cassette 14 are sequentially processed;

[0074] Step S2, opening the lid of the FOUP 14 in the working state, and closing the lid of the FOUP 14 in the standby state;

[0075] In step S3, the w...

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Abstract

The invention provides a front-end module of semiconductor equipment, semiconductor equipment and a wafer processing method. The front-end module of the semiconductor equipment is connected with the reaction chamber module and includes a buffer chamber, at least two wafer loading ports, at least one robot arm, a box opening device and a control device. The control device of the front-end module of the semiconductor equipment of the present invention can place the FOUP placed on the wafer loading port in the working state and the standby state respectively according to the process requirements, and ensure that when one FOUP is in the working state, other The FOUP pods are all in a standby state, and the FOUP pods in the standby state are closed to reduce pollution. Adopting the semiconductor equipment of the present invention can ensure that the wafers to be processed maintain good cleanliness, which is conducive to the normal progress of process processing; adopting the wafer processing method of the present invention can effectively improve the cleanliness in the wafer processing process, effectively Improve production yield and reduce production cost.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a front-end module of semiconductor equipment, semiconductor equipment and a wafer processing method. Background technique [0002] With the increasing integration of semiconductor chips, there are more and more wafer manufacturing processes. During the wafer manufacturing process, the wafer needs to be transferred between different process modules through the Automatic Material Handling System (AMHS). More specifically, the wafer is loaded in the wafer boat or the front opening The wafer box (Front Opening Unified Pod, FOUP) is transferred between different process modules through the AMHS system. In order to minimize the contamination of wafers during transfer, in addition to trying to improve the cleanliness of the wafer transfer path, the proper use of various equipment in the wafer transfer path is also very important. The importance of the semiconductor equipmen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67265H01L21/67772H01L21/67775H01L21/67778
Inventor 不公告发明人
Owner CHANGXIN MEMORY TECH INC
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