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A heat dissipation device for a computer

A technology of cooling device and computer, applied in computing, instrument, electrical digital data processing and other directions, can solve the problems of not meeting the needs of modern people, affecting the performance of the host, simple and single structure, etc., to ensure the use effect and use efficiency, Reasonable design and the effect of improving heat dissipation efficiency

Inactive Publication Date: 2019-06-25
天津码上科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, when computer hardware devices such as desktop computer mainframes are in use, especially in hot environments such as summer, and the mainframe works for a long time, the internal working temperature of the mainframe is relatively high. When the existing mainframe heat dissipation mechanism is in use, the structure is relatively simple and single. Moreover, the heat dissipation effect is poor, which affects the performance of the host, and has become increasingly unable to meet the needs of modern people. Therefore, we propose a heat dissipation device for computers

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  • A heat dissipation device for a computer
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Embodiment Construction

[0014] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0015] Such as Figure 1-2 As shown, a heat dissipation device for a computer includes a main body 1 and a heat conduction pipe group 15, an upper heat dissipation case 10 is arranged on the top of the main body 1, a lower heat dissipation case 11 is arranged on the bottom of the main body 1, and a heat dissipation case 11 is arranged on the bottom of the main body 1. 1 is provided with a host power supply 2, a small leakage current monitor 20 and a terminal block 19, and a temperature controller 12 and a cooling fan 13 are arranged in the upper heat dissipation shell 10 and the lower heat dissipation shell 11, and the heat dissipation fan 13 and the temperature control The temperature controller 12 is electrically connected, and the working end o...

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Abstract

The invention discloses a heat dissipation device for a computer. The device comprises a host body and a heat-conducting water pipe group, an upper heat dissipation shell is arranged at the top of thehost body; a lower heat dissipation shell is arranged at the bottom of the host body; a host power supply is arranged on the rear side of the host body; The invention discloses a small leakage current monitor and a wiring board. temperature controllers and heat dissipation fans are arranged in the upper heat dissipation shell and the lower heat dissipation shell; the cooling fan is electrically connected with the temperature controller; the working end of the temperature controller is positioned in the host body; A heat conducting piece set and a heat conducting water pipe set are arranged onone side of the main machine body, the heat conducting water pipe set is fixedly arranged on the surface layer of the main machine body and connected with the heat conducting piece set, a temperaturesensor is arranged on the surface layer of the bottom of the main machine body, and the working end of the temperature sensor is located in the main machine body. The heat dissipation device for thecomputer is reasonable in design and convenient to use, and the overall combined type heat dissipation mechanism has a good heat dissipation effect and is suitable for being widely popularized.

Description

【Technical field】 [0001] The invention relates to a heat dissipation mechanism, in particular to a heat dissipation device for a computer. 【Background technique】 [0002] At present, when computer hardware devices such as desktop computer mainframes are in use, especially in hot environments such as summer, and the mainframe works for a long time, the internal working temperature of the mainframe is relatively high. When the existing mainframe heat dissipation mechanism is in use, the structure is relatively simple and single. Moreover, the heat dissipation effect is poor, which affects the performance of the mainframe, and can no longer meet the needs of modern people. Therefore, we propose a heat dissipation device for computers. 【Content of invention】 [0003] The main purpose of the present invention is to provide a cooling device for a computer, which can effectively solve the problems in the background technology. [0004] In order to achieve the above object, the t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18
Inventor 安朋成
Owner 天津码上科技有限公司
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