Preparation method of electromagnetic shielding layer of packaged product and packaging product

Abstract

The invention relates to a preparation method of an electromagnetic shielding layer of a packaged product and the packaged product. According to the method, a compartment is firstly formed on a molding compound of a package substrate; an electromagnetic shielding layer is arranged on the inner side wall of the compartment; a package device is assembled in the compartment; the compartment is filledwith the molding compound; the molding compound is thinned; and another electromagnetic shielding layer is coated on the surface of the molding compound above the compartment to form a complete electromagnetic shielding structure around and above the compartment. The electromagnetic shielding layer prepared by the method has uniform thickness and good controllability; and the compartment is formed by a molding and sealing mold, and the compartment inside the packaged product does not need to be cut, thereby ensuring the firmness of the packaged product. The method can be used for the production of single-compartment and multi-compartment electromagnetic shielding layers, and is particularly suitable for the condition that the interior of the packaged product requires independent compartment shielding, and is good in shielding effect, simple in process and suitable for the packaged products with complicated interior structures and different compartment sizes.

Description

Technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a method for preparing an electromagnetic shielding layer of a packaged product and a packaged product. Background technique [0002] At present, in some semiconductor packaging products, many products require anti-electromagnetic interference to prevent abnormal signals due to electromagnetic interference during product operation. This requires an electromagnetic shielding layer to cover or wrap the product to achieve the purpose of preventing electromagnetic interference. . The main method of making electromagnetic shielding layer is to plate or spray a layer of electromagnetic shielding layer on the four sides and top surface of a single product, or attach a layer of metal film. This method is mainly used for the overall shielding of a single product. This method is not suitable when there are multiple compartments inside the product and independent shielding is re...

AI Technical Summary

Problems solved by technology

The main method of making the electromagnetic shielding layer is to coat or spray a layer of electromagnetic shielding layer on the four sides and the top surface of a single product, or attach a layer of metal film. This method is mainly used for the overall shielding of a single product. This method is not suitable for the case where there are multiple partition structures inside a single product and independent shielding is required. To set up an independent shielding structure in multiple partition structures inside a single product, it is generally cut on the molding compound after the production of the packaged product is basically completed. Form a cutting line, assemble the electromagnetic shielding layer into the cutting line, and finally fill the cutting line. The structure of the packaged product after cutting is not strong, it is easy to be damaged during installation and use, and the cutting depth is difficult to control. At the same time, if the cutting line is too narrow, the electromagnetic The assembly of the shielding layer will be uneven or difficult to assemble; the cutting line is too wide, and the cutting line needs to be filled after the electromagnetic shielding layer is assembled, which needs to be improved

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