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Double H-shaped compression beam silicon micro-resonant pressure sensor chip and preparation method thereof

A pressure sensor, silicon micro technology, applied in the measurement of force by measuring the frequency change of the stressed vibration element, measuring the fluid pressure, piezoelectric devices/electrostrictive devices, etc., can solve the driving force instability, unstable , it is difficult to arrange double H-type resonators, etc., to achieve the effect of improving sensitivity and ensuring structural stability

Active Publication Date: 2019-06-14
XI AN JIAOTONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, most resonant pressure sensors have poor quality factors and are unstable, which can easily cause unstable driving force, thus increasing the difficulty of closed-loop control.
In most electrostatically excited resonant sensors, it is easy to cause out-of-plane displacement fluctuations of the movable electrode after loading, which increases the difficulty of closed-loop control; and on a single pressure diaphragm, it is difficult to arrange double H-shaped resonators, and the quality factor is improved. restricted

Method used

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  • Double H-shaped compression beam silicon micro-resonant pressure sensor chip and preparation method thereof
  • Double H-shaped compression beam silicon micro-resonant pressure sensor chip and preparation method thereof
  • Double H-shaped compression beam silicon micro-resonant pressure sensor chip and preparation method thereof

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Embodiment Construction

[0045] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0046] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner" and "outer" are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and Simplified descriptions, rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and thus should not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importan...

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Abstract

The invention discloses a double H-shaped compression beam silicon micro-resonant pressure sensor chip and a preparation method thereof. The sensor chip comprises a resonant layer and a pressure-bearing membrane. The resonant layer comprises a resonant beam and a balance beam. The four resonant beams form a group of H-shaped beams. The two groups of H-shaped beams are symmetrically arranged. The end parts of the resonant beams are fixed on the balance beams, the two balance beams are connected with the rigid mass block through extension parts of the resonant beams, the mass block is arranged between the adjacent resonant beams, the coupling beam is arranged in the middle of the mass block, the vibration pick-up resistor is arranged in the middle of the coupling beam, and the two mass blocks positioned on the outer side are respectively and fixedly connected with the two movable electrodes. When pressure is applied to the pressure-bearing diaphragm for loading; The resonant beam is pressed to deform, the inherent frequency of the resonant beam is changed, meanwhile, when the resonant beam is excited to vibrate and in a resonant state through the fixed electrode, the vibration pick-up resistors on the coupling beam are in the pressed / pulled state in a circulating mode, the vibration pick-up resistance value is changed based on the piezoresistive effect, and therefore the inherentfrequency of the resonant beam is picked up.

Description

technical field [0001] The invention belongs to the technical field of micro-nano electronic sensors, and in particular relates to a silicon micro-resonant pressure sensor chip with double H-shaped pressure beams and a preparation method thereof. Background technique [0002] The silicon resonant pressure sensor is the pressure sensor with the highest precision at present. It measures the pressure indirectly by detecting the natural frequency of the resonant structure, and it is a quasi-digital output. Its accuracy is mainly affected by the mechanical characteristics of the structure, so it has strong anti-interference ability and stable performance. In addition, silicon resonant pressure sensors also have the advantages of wide frequency band, compact structure, low power consumption, small size, light weight, and mass production, etc., and have always been the focus of research in various countries. Silicon microresonant pressure sensors can be used in airborne air data t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B3/00B81C1/00B81C3/00G01L1/10G01L9/00
Inventor 赵立波韩香广李雪娇郭鑫皇咪咪卢德江王久洪赵玉龙蒋庄德
Owner XI AN JIAOTONG UNIV
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