Holding device for holding circuit boards and such like

Abstract

The invention relates to a holding device for holding substrates such as printed circuit boards, metal sheets, foils or the like, comprising a suction surface, the suction surface having a plurality of suction nozzles and the suction nozzles being subjected to a negative pressure relative to the ambient pressure by means of a device providing negative pressure for providing a holding force for oneor more substrates, wherein the device providing negative pressure provides negative pressure, such that the ratio of the cumulated drop in pressure of all suction nozzles to the cumulated drop in pressure of all suction nozzles and supply lines of the suction nozzles up to the device providing negative pressure is greater than 0.25%, in particular greater than 1%, preferably greater than 25%, inparticular greater than 35%, preferably greater than 40%.

Description

technical field [0001] The invention relates to a holding device for holding substrates, such as circuit boards, metal plates, films, etc., said holding device comprising a suction surface, wherein the suction surface has a plurality of suction nozzles and wherein the suction nozzles can be provided by means of a negative pressure supply device Loaded with a negative pressure relative to ambient pressure to provide retention for the one or more substrates. [0002] The invention also relates to a method for holding substrates, such as circuit boards, metal plates, films, etc., wherein one or more substrates are held by means of a suction surface, wherein the suction surface has a plurality of suction nozzles, and wherein the suction nozzles are loaded with Negative pressure relative to ambient pressure to provide retention for one or more substrates. [0003] The invention also relates to an inkjet printing device. Background technique [0004] Circuit boards, metal sheets...

AI Technical Summary

Problems solved by technology

[0008] The disadvantage here is that regions on the processing table and openings in the substrate have to be glued or masked in a complex manner, which is extremely time-consuming especially in the case of large openings or in the case of a large number of smaller openings

Furthermore, the openings have to be removed in a complex manner after processing or machining

This creates a certain probability of damage to the processed substrate

In addition, adhesive residues can remain on the suction table, which must be removed in a complex manner prior to the processing of another substrate

Also, during the processing of the substrate, the corresponding cover or adhesive part may come off, which causes the substrate to be processed incorrectly and / or damages the corresponding processing equipment

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