Laser edge milling device and method for packaging substrate

A packaging substrate and laser technology, applied in welding equipment, laser welding equipment, metal processing equipment, etc., can solve the problems of increased production turnaround time, difficulty in tearing copper foil from board parts, increased production costs, etc., to eliminate adverse effects, Reduce the action of one transfer plate and save the effect of parts replacement

Inactive Publication Date: 2019-06-07
WUXI SHENNAN CIRCUITS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this milling positioning method has the disadvantages of increasing the production turnaround time and increasing the production cost due to the many processes, and this positioning method will leave a plurality of posit...

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  • Laser edge milling device and method for packaging substrate
  • Laser edge milling device and method for packaging substrate
  • Laser edge milling device and method for packaging substrate

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0028] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.

[0029] In addition, if there are descriptions involving "first", "second" and ...

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Abstract

The invention discloses a laser edge milling device and method for a packaging substrate. The laser edge milling device comprises a rack shell, a workbench, a laser device, an X-ray device and a mainmachine, wherein the rack shell is provided with a hollow inner cavity and an inlet plate port communicating with the inner cavity; and the workbench, the laser device and the X-ray device are all arranged in the inner cavity, the main machine is connected with the workbench, the X-ray device and the laser device, the main machine is used for controlling the workbench to place and transfer the packaging substrate, a theoretical position of the packaging substrate is obtained by controlling the X-ray device, and the laser device is controlled to carry out laser milling on the packaging substrate according to the theoretical position. According to the technical scheme, the cost problem and quality in the production process of the packaging substrate can be reduced and improved.

Description

technical field [0001] The invention relates to the technical field of electronic circuit boards, in particular to a laser edge milling device and method for packaging substrates. Background technique [0002] In the production process of packaging substrates, it is necessary to produce multilayer boards by lamination, that is, lamination, and the board edges of the laminated multilayer boards are usually in the state of burrs, which need to be deburred. The current traditional process for removing burrs is as follows: First, after the lamination process, the multilayer board is placed on the work table; then, the supporting X-ray equipment first sees through the x-ray (x-ray) The image of the inner layer, and grab and drill the inner layer target inside the multi-layer board through the x-ray drilling target; finally, after the matching edge milling machine is drilled through the x-ray drilling target for hole positioning, Manual edge milling is then performed to remove bu...

Claims

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Application Information

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IPC IPC(8): B23K26/36B23K26/361H05K3/00
Inventor 杨平宇杨智勤徐永斌张建
Owner WUXI SHENNAN CIRCUITS CO LTD
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