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Temperature field and deformation field synchronous measurement method and device based on DIC

A technology of synchronous measurement and temperature field, applied in measurement devices, optical devices, instruments, etc., to overcome the problems of complexity and non-synchronization, and to achieve the effect of simple operation

Active Publication Date: 2019-06-04
SOUTHEAST UNIV
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Problems solved by technology

[0004] Purpose of the invention: The present invention provides a method and device for synchronous real-time measurement of temperature field and deformation field based on DIC, which realizes the synchronous acquisition of temperature field and deformation field, is easy to operate, and overcomes the complexity and asynchrony of existing measurement methods question

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  • Temperature field and deformation field synchronous measurement method and device based on DIC
  • Temperature field and deformation field synchronous measurement method and device based on DIC
  • Temperature field and deformation field synchronous measurement method and device based on DIC

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Embodiment Construction

[0034] The present invention will be described in further detail below in conjunction with the accompanying drawings. In this embodiment, the test piece is made of Inconel 718 material with a rectangular cross-section; the KN6 type resistant to 1800°C temperature-indicating paint is selected, which has 13 discoloration points at 100°C to 1200°C. The specific implementation steps are as figure 1 shown, including the following steps:

[0035] (1) Spray the KN6 temperature-indicating paint evenly on the surface of the test sample to form random speckles.

[0036] (2) Take one of the tested samples of the same batch as a calibration block for temperature calibration test, place the calibration block in a quartz lamp heating furnace, heat it uniformly for 2 minutes in a high temperature environment, and then rise step by step with a temperature gradient of 5°C, each The temperature rise rate of the stage is 10°C / min, and the heating range is 100°C to 1200°C. Use a color CCD came...

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Abstract

The invention discloses a temperature field and deformation field synchronous measurement method and device based on DIC. The method is characterized by using a color CCD camera to cooperate with a filter to obtain surface speckle images of a measured sample at different temperatures in real time; using a calibration block made from the same batch of samples in advance to carry out a calibration test of a 5 DEG C temperature gradient; and converting data to a CIEL*a*b* color space with visual consistency and using a cubic spline interpolation to acquire a continuous temperature calibration curve. Real-time measurement of a temperature field is performed through combining the temperature calibration curve and by using a color change of a pixel point containing chameleon paint in the speckleimage, and a gray gradient image converted by the speckle image is used to carry out fast search of a sub-pixel deformation field so as to realize the synchronization acquisition of the temperature field and the deformation field. Operation is simple, and complexity and an asynchronous problem of an existing measurement method are overcome.

Description

technical field [0001] The invention belongs to the technology of measuring material performance and temperature at high temperature, and in particular relates to a method and device for synchronously measuring temperature field and deformation field based on DIC. Background technique [0002] The simultaneous measurement of temperature field and deformation field is the basis for studying the thermodynamic properties of materials. At present, the high-temperature deformation measurement methods mainly include contact and non-contact measurement, and non-contact measurement has been widely studied due to its non-contact and full-field characteristics. Among them, the digital image correlation (DIC) method uses speckle as the information carrier. Characterizing the deformation of objects has the advantages of simple operation, low test environment requirements and high precision, and has developed rapidly. For non-contact temperature field measurement, infrared thermal image...

Claims

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Application Information

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IPC IPC(8): G01B11/16G01N25/20G01N21/84
Inventor 费庆国王凯董萼良何顶顶姜东
Owner SOUTHEAST UNIV
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