Die-cutting process of adhesive product and adhesive product

Abstract

The invention relates to the technical field of adhesive products, and discloses a die-cutting process of adhesive products and adhesive products. The die-cutting process includes steps: S1, compounding a bottom protective film on the non-release surface of the release film; S2, Die-cut the waste discharge knife line on the release film, the waste discharge knife line runs through the release film along the length direction of the release film and the waste discharge knife line runs through the release film and is compounded on the release film The area corresponding to the silicone product on the film; S3. Cover the release surface of the release film with a silicone product, and the silicone product is located at the position of the waste discharge knife line on the release film; S4. A layer of protective film is compounded on the non-adhesive surface of the silicone product; S5, removing the bottom protective film to obtain a finished adhesive product. The die-cutting process can avoid defects such as lack of finished products and displacement, and improve product yield. The adhesive product disclosed by the invention prevents the silicone product from being taken away by the release film when the release film waste is discharged along the waste discharge knife line by setting the waste discharge knife line on the release film.

Description

technical field [0001] The invention relates to the technical field of adhesive products, in particular to a die-cutting process of adhesive products and adhesive products. Background technique [0002] With the rapid development of the electronics industry, the die-cutting process has gradually expanded from the traditional die-cutting of printed matter to the production of auxiliary materials for electronic products, such as the preparation of electronic product bonding, dustproof, shockproof, and insulation by die-cutting technology , Shielded adhesive products and film products. [0003] The traditional process of die-cutting adhesive products generally includes the following steps: composite release film and protective film; die-cut release film, waste discharge (release film); die-cut protective film, waste discharge (protective film) , to obtain the finished adhesive product. [0004] At present, due to the development trend of portable and thinner electronic produc...

AI Technical Summary

Problems solved by technology

Use the traditional die-cutting process to process small high-viscosity silicone-based adhesive products. When the release film waste is removed after the die-cutting of the silicone-based products, due to the high viscosity of the silicone-based products, the adhesive effect between the silicone products and the release film The force is greater than the force between the high-viscosity silicone products and the protective film. When the release film is discharged, the high-viscosity silicone products are easily taken away by the release film, resulting in defects such as lack of finished products and displacement, and the product yield is greatly reduced.

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