Bombax ceiba aerogel thermal insulation board

A thermal insulation and airgel technology, which is applied in thermal insulation, climate change adaptation, insulation improvement, etc., can solve the problems of high equipment requirements, complicated process, and large energy consumption, and achieve good thermal insulation effect and simple production process , The effect of production cost reduction

Inactive Publication Date: 2019-05-17
张全康
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  • Application Information

AI Technical Summary

Problems solved by technology

Insulation mortar has the following disadvantages: high density, high thermal conductivity, high moisture absorption, and large changes in strength affected by construction factors
It is light in weight and good in thermal insulation and sound insulation performance, but their conventi...

Method used

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  • Bombax ceiba aerogel thermal insulation board

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Embodiment Construction

[0011] Below will combine the appended in the embodiment of the present invention figure 1 , clearly and completely describe the technical solutions in the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0012] Such as figure 1 As shown, a kapok airgel thermal insulation board, comprising: a panel (1), a bottom plate (3) and a thermal insulation core board (2); the panel (1) and the bottom plate (3) are respectively fixed and attached On the upper and lower surfaces of the thermal insulation core board (2), the panel (1) and the bottom plate (3) are inorganic cementitious materials, and the inorganic cementitious materials are magnesium oxychloride cement (magnesium oxide and magnesium chloride), magnesium oxysulfide cement (magnesium oxide and magnesium sulfate), one or two or th...

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Abstract

The invention discloses a bombax ceiba aerogel thermal insulation board. The bombax ceiba aerogel thermal insulation board comprises a panel (1), a bottom board (3) and a thermal insulation core board(2); the panel (1) and the bottom board (3) are respectively fixed and fitted on the upper surface and the lower surface of the thermal insulation core board (2), the panel (1) and the bottom board (3) are made of an inorganic cementitious material; the thermal insulation core board (2) is prepared by taking a bombax ceiba aerogel as the main material, doping a bombax ceiba fire resistant fiber and the inorganic cementitious material, stirring, foaming and wrapping, the bombax ceiba aerogel is a SiO2 aerogel prepared by taking bombax ceiba as the raw material through a cracking process. The ultralight density and the ultralow heat conductivity coefficient of the bombax ceiba aerogel and the high strength and flame retardant property of the inorganic cementitious material are used, so thatthe bombax ceiba aerogel thermal insulation board is environmentally friendly in comparison with the conventional SiO2 aerogel thermal insulation product, the cost is low, the production process is simple, the strength is high, the density is low, the thermal insulation effect is better, and the bombax ceiba aerogel thermal insulation board belongs to a light green environmentally friendly product.

Description

technical field [0001] The invention relates to a light-weight thermal insulation material for building, in particular to a kapok airgel thermal insulation board with kapok airgel as the main material. Background technique [0002] At present, for building exterior wall insulation, inorganic insulation materials must be used for high-rise buildings, so most high-rise buildings use insulation mortar for insulation. Insulation mortar is a kind of ready-mixed dry powder mortar made of various light materials as aggregates, cement as cementitious material, mixed with some modified additives, and mixed by mixing. It is used to construct a building surface insulation layer. kind of building material. Insulation mortar has the following disadvantages: high density, high thermal conductivity, high hygroscopicity, and large changes in strength affected by construction factors. Moreover, the existing composite thermal insulation boards are mainly prepared from internal thermal insul...

Claims

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Application Information

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IPC IPC(8): E04B1/80E04B1/94
CPCY02A30/24Y02B80/10
Inventor 张全康
Owner 张全康
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