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White LED chip

A technology of LED chips and white light, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as the large difference between the color temperature of the center point and the average color temperature, and achieve improved light extraction efficiency, application range, and convenience of use. The effect of spot uniformity

Inactive Publication Date: 2019-05-14
LATTICE POWER (JIANGXI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above problems, the present invention aims to provide a white light LED chip, which can effectively solve the technical problem of the large difference between the color temperature of the center point of the existing white light LED chip and the average color temperature

Method used

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Embodiment Construction

[0034] Such as figure 2 Shown is a schematic structural diagram of an embodiment of a white LED chip provided by the present invention, the white LED chip includes: a metal electrode, a flip-chip blue LED chip 1, a transparent silica gel 2, a high-reflective adhesive 5, and a fluorescent film 3; , the metal electrode is set on the surface of the electrode pad in the LED chip; the fluorescent film 3 is set on the upper surface of the LED chip, the area is larger than the area of ​​the LED chip surface, and it is arranged symmetrically along the center of the LED chip, and the fluorescent film 3 is doped TiO with a mass ratio of 0.5 to 5% 2 Powder; transparent silica gel 2 is arranged around the LED chip in an arc shape on the surface of the fluorescent film 3 toward the fluorescent film 3; high-reflective glue 5 is arranged around the LED chip along the surface of the transparent silica gel 2, and the high-reflective glue 5 does not exceed the surface of the LED chip metal el...

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Abstract

The invention provides a white LED chip comprising a metal electrode, a flip-chip blue LED chip, a transparent silica gel, a high anti-adhesive and a fluorescent film, wherein the metal electrode is disposed on the surface of the electrode pad in the LED chip; the fluorescent film is provided on the upper surface of the LED chip with the area larger than the surface area of the LED chip and is symmetrically disposed along the center of the LED chip, and the fluorescent film is doped with titanium dioxide powder having a mass ratio of 0.5 to 5%; the transparent silica gel is arranged in an arcshape around the LED chip on the surface of the fluorescent film facing the fluorescent film; the high anti-adhesive is disposed around the LED chip along the surface of the transparent silica gel anddoes not exceed the metal electrode on the surface of the LED chip. In the white LED chip, the color uniformity of the white LED chip is better while reducing the difference between the color temperature of the center point of the white LED chip and the average color temperature.

Description

technical field [0001] The invention relates to the field of semiconductor light emitting diodes, in particular to a white LED chip. Background technique [0002] LED (Light Emitting Diode, Light Emitting Diode) is a solid-state semiconductor device that can convert electrical energy into visible light. Light, thus directly converting electrical energy into light energy. LED, especially white LED, is widely used as a new lighting source material. It has the advantages of fast response, good shock resistance, long life, energy saving and environmental protection, and has developed rapidly. It has been widely used in landscaping and Indoor and outdoor lighting and other fields. [0003] In traditional SMD packaging, ceramic packaging, and chip-level packaging CSP products, because the area of ​​the LED chip is smaller than the area coated with phosphor powder, the brightness of the surface of the LED chip will be higher than that of the surrounding area of ​​the chip, and th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/50H01L33/54H01L33/60
Inventor 肖伟民梁伏波徐海李珍珍
Owner LATTICE POWER (JIANGXI) CORP
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