Method for realizing surface planarization of a pit-shaped micro-array structure unit through secondary pressing

Abstract

The invention relates to a method for realizing surface planarization of a pit-shaped micro-array structure unit through secondary pressing, and belongs to the field of machinery. The machining process of the pit-shaped micro-array structure unit is simulated, that is, a Vickers pressure head is pressed into the surface of a material to form a pit unit with the characteristic size being in the micron order, and due to the effect of force borne by the surface of the material, a protruding phenomenon can be formed on the periphery of a pit and exists along with residual stress. In order to flatten the surface and reduce the residual stress of the surface, a cubic angle pressing needle is used for vertically pressing the side faces of the pit units with the feature sizes of micron order to form indentations with the feature sizes of nano order to release the residual stress stored in the material, so that the purpose of flattening the functional surface is achieved. The method provides asurface planarization method for the functional surface of the microarray structure manufactured by the precision machining technology. Operation is easy, equipment functions are rich, and the devicecan be used for large-scale batch machining.

Description

technical field [0001] The invention relates to the mechanical field, in particular to a method for realizing planarization of the surface of a pit-shaped microarray structure unit by secondary pressing. The surface flattening treatment can be carried out on the surface protrusion phenomenon caused by the action of force during the precision machining process of the pit-shaped micro-array mechanism unit. It can provide a planarization method for surface processing of pit-shaped microarray structural units involved in bionic engineering, aerospace, communication engineering and other fields. Background technique [0002] Microstructure functional surface refers to a type of surface with regularly distributed microscopic geometric topological shapes, and its structure size is generally 10−100 μm. Its microscopic geometry is usually in the form of an array, so it is called a microarray structure. Typical microarray structures include pit-shaped arrays, microlens arrays, pyram...

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Problems solved by technology

[0005] The purpose of the present invention is to provide a method for second press-in to realize the flattening of the surface of the pit-shaped microarray structure unit, which overcomes the deficiencies of the surface protrusion of the material and the residual stress inside the material caused by the precision machining of the existing microarray structure. Secondary pressing releases the residual stress existing inside the material, making the surface energy tend to be more stable and achieving the purpose of surface flattening

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