Dip-molding and leveling method and device, and dip-molding method for micro-precision devices

A leveling and dipping technology, which is applied to coatings, tubular objects, household appliances, etc., can solve the problems of no rubber accumulation, uneven leveling of liquid slurry, disadvantages, etc., to improve reproducibility and consistency , high process flexibility and high efficiency

Active Publication Date: 2020-10-30
厦门石地医疗科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Dip molding is a very mature process, which has the characteristics of convenient development and high production efficiency, but it has no advantages in forming small and precise products, and the prepared products are different from other high-tech products such as injection molding and extrusion in terms of consistency and reproducibility. Molecular molding process has a big disadvantage
For example, when dipping and molding pipe products with a diameter of less than 1mm, how to make the surface of the product free of rubber accumulation is a difficult problem, which cannot be realized by the existing dipping technology.
[0003] Traditional tiny tube products can only be obtained through precise extrusion of an extruder and then cutting. The entire process is very cumbersome
If the plastic dipping process is used to form tiny tube products, the most prominent problem at present is that the liquid slurry has uneven leveling and accumulation, resulting in low consistency of the wall thickness of the tubes.

Method used

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  • Dip-molding and leveling method and device, and dip-molding method for micro-precision devices
  • Dip-molding and leveling method and device, and dip-molding method for micro-precision devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] (1) Slurry preparation: prepare liquid PVC slurry, put it into a mixer and stir evenly to obtain the slurry;

[0043] (2) Stand still and vacuumize: After the slurry is left to stand for 1h, put it into a vacuum box to vacuumize and remove the air bubbles in the slurry;

[0044] (3) Mold preheating: Preheat the mold with a diameter of 0.4mm to 120°C, test the temperature of the mold through the temperature sensing line, and obtain the preheated mold;

[0045] (4) dipping: the manipulator clamps the preheated mold and vertically immerses it in the slurry in the glue tank, and takes it out after 3 seconds by the timer to obtain the mold coated with slurry;

[0046] (5) Leveling: The manipulator drives the coated mold into the leveling cavity where there is an airflow parallel to the mold. The centrifuge drives the coated mold to rotate at a speed of 60rpm / min. The wind speed of the airflow is 3m / s, and the flow rate is obtained. Mold after flattening.

[0047] (6) Curin...

Embodiment 2

[0050] (1) Slurry preparation: prepare addition-type liquid silicone slurry, put it into a mixer and stir evenly to obtain the slurry;

[0051] (2) standing vacuum: after the slurry is left to stand for 1.2h, put it into a vacuum box and vacuumize to remove the air bubbles in the slurry;

[0052] (3) Mold preheating: Preheat the mold with a diameter of 0.3mm to 60°C, test the temperature of the mold through the temperature sensing line, and obtain the preheated mold;

[0053] (4) dipping: the manipulator clamps the preheated mold and vertically immerses it in the slurry in the glue tank, and takes it out after 1 second with the timer to obtain the mold coated with slurry;

[0054] (5) Leveling: The manipulator drives the coated mold into the leveling chamber where there is an airflow parallel to the mold. The centrifuge drives the coated mold to rotate at a speed of 120rpm / min. The wind speed of the airflow is 20m / s, and the flow rate is obtained. Mold after flattening.

[0...

Embodiment 3

[0058] (1) Slurry preparation: prepare polycondensation-type liquid silicone slurry, put it into a mixer and stir evenly to obtain the slurry;

[0059] (2) Static vacuuming: After the slurry is left to stand for 0.5h, put it into a vacuum box and vacuumize to remove the air bubbles in the slurry;

[0060] (3) Mold preheating: Preheat the mold with a diameter of 0.6mm to 60°C, test the temperature of the mold through the temperature sensing line, and obtain the preheated mold;

[0061] (4) dipping: the manipulator clamps the preheated mold and vertically immerses it in the slurry in the glue tank, and takes it out after 2 seconds by the timer to obtain the mold coated with slurry;

[0062] (5) Leveling: The manipulator drives the coated mold into the leveling cavity where there is an airflow parallel to the mold. The centrifuge drives the coated mold to rotate at a speed of 90rpm / min, and the wind speed of the airflow is 10m / s. Mold after flattening.

[0063] (6) Curing at co...

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Abstract

The invention provides a plastic dipping levelling method and device and a plastic dipping molding method for a micro precise device. The plastic dipping levelling method comprises the steps that a plastic dipping and coating mold is connected to a centrifugal machine and arranged in air flow parallel to the mold, and the centrifugal machine drives the coating mold to rotate. The plastic dipping levelling device comprises the centrifugal machine, a levelling cavity and an air flow control mechanism; the centrifugal machine is connected with the plastic dipping and coating mold and used for driving the coating mold to rotate; the levelling cavity is used for containing the plastic dipping and coating mold and contains the air flow parallel to the mold; and the air flow control mechanism isconnected with the levelling cavity and used for supplying the air flow parallel to the mold to the levelling cavity. According to the method, plastic dipping levelling of a high-precision product canbe achieved; and the method is high in production efficiency and technology flexibility, capable of achieving different technological effects on the same mold and suitable for mass production.

Description

technical field [0001] The invention relates to the field of plastic dipping, and more specifically, to a dipping and leveling method and device, and a method for dipping and molding micro precision devices. Background technique [0002] Dip molding is a very mature process, which has the characteristics of convenient development and high production efficiency, but it has no advantages in forming small and precise products, and the prepared products are different from other high-tech products such as injection molding and extrusion in terms of consistency and reproducibility. Compared with the molecular molding process, there are great disadvantages. For example, when dip molding pipe products with a diameter of less than 1mm, how to make the surface of the product free of rubber accumulation is a difficult problem, which cannot be realized by the existing dip molding technology. [0003] Traditional tiny tube products can only be obtained by precise extrusion of an extrude...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C41/04B29C41/52B29L23/00
CPCB29C41/042B29C41/52B29L2023/00
Inventor 段庆生
Owner 厦门石地医疗科技有限公司
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