Object Inspection System for Object Anomaly Inspection

Abstract

The invention relates to an object inspection system for object abnormity inspection. The object inspection system comprises illumination equipment which is configured to irradiate an object to be inspected and camera equipment which is configured to carry out image shooting on the object to be inspected under the irradiation of the illumination equipment. The illumination device comprises a curved surface light cover and a plurality of monochromatic visible light sources, wherein the curved surface light cover has a concave curved surface which is arranged to face the object to be inspected;the plurality of monochromatic visible light sources are arranged on the concave curved surface of the curved surface light cover and are used for irradiating the object to be inspected; and the positions of the plurality of monochromatic visible light sources and the shape of the concave curved surface can make irradiation light formed by monochromatic visible light emitted by the plurality of monochromatic visible light sources in a predetermined illumination range irradiate the object to be inspected, and the illumination deviation of the irradiation light does not exceed 10%. The object inspection system can acquire a clear object image, and whether the object to be inspected is abnormal can be determined based on the object image.

Description

technical field [0001] The present disclosure relates to the technical field of object inspection, and in particular, relates to an object inspection system for abnormal inspection of objects. Background technique [0002] In the semiconductor manufacturing process, abnormal factors such as damage, foreign matter, and deformation on equipment components will have an impact on the quality of semiconductor products being processed. For example, when testing a semiconductor chip, a chip socket is used, and the chip socket is used to insert the chip to test it. When the pins (Pin) of the chip socket are damaged, foreign objects, deformed, burned and other abnormalities, it may cause quality problems such as indentations on the substrate, leads, solder balls, etc. of the chip. A large number of semiconductor chips can be plugged into the same chip socket. Therefore, when the above-mentioned abnormality exists in the chip socket, quality problems may occur in a large number of s...

AI Technical Summary

Problems solved by technology

Therefore, when the above-mentioned abnormalities exist in the chip socket, it may cause quality problems in a large number of semiconductor chips, resulting in yield loss

[0003] In the prior art, quality problems caused by abnormal equipment components cannot be detected by inspection tools until the products processed by the abnormal equipment components reach a specific inspection process

However, by the time the inspection tools detected these quality problems, a large number of products had been processed by abnormal equipment parts

Therefore, because the existing technology cannot detect the abnormality of the equipment components in time, the yield has been lost when the equipment components are found to be abnormal.

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