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Full-automatic mounting system of tape-type flaky electronic components

A technology for electronic components and placement systems, applied in the field of automatic placement systems, which can solve problems such as low efficiency and unstable quality

Pending Publication Date: 2019-04-16
SUZHOU WISETECH AUTOMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the above problems, the present invention provides a fully automatic mounting system for braided chip electronic components, which can solve the problems of low efficiency and unstable quality in surface mounting by manual mounting

Method used

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  • Full-automatic mounting system of tape-type flaky electronic components
  • Full-automatic mounting system of tape-type flaky electronic components
  • Full-automatic mounting system of tape-type flaky electronic components

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Embodiment Construction

[0059] See Figure 1 ~ Figure 3 , the fully automatic placement system for braided chip electronic components of the present invention includes a rack platform 10, and it also includes a feeding and receiving device 50 for braided components and a component positioning device that is installed on the rack platform 10. Device 20, auxiliary material feeding device 30 and auxiliary material suction and placement device 40, component positioning device 20 is horizontally installed on the frame platform 10 along the horizontal direction, and the horizontal left and right ends of component positioning device 20 are respectively the feeding end of braided type components, At the discharge end, the feeding and receiving device of the braided component includes a discharging mechanism 50a and a receiving mechanism 50b. One side of the feed end and one side of the discharge end of the positioning device 20, and the discharging mechanism 50a, the component positioning device 20, and the ...

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Abstract

The invention provides a full-automatic mounting system of tape-type flaky electronic components. The system can solve the problems that the manual mounting mode is low in efficiency and unstable in quality. The system comprises a tape-type component collecting and placing device, a component positioning device, an auxiliary material feeding device and an auxiliary material sucking and mounting device, wherein the component positioning device, the auxiliary material feeding device and the auxiliary material sucking and mounting device are all installed on a frame platform, the component positioning device is horizontally installed on the machine frame platform in a horizontal mode, the transverse two ends of the component positioning device are a feeding end and a discharging end of the tape-type components, the tape-type component collecting and placing device comprises a discharging mechanism and a collecting mechanism which are installed on one side of the feeding end and one side of the discharging end of the component positioning device, the discharging mechanism, the component positioning device and the collecting mechanism are arranged on the same transversal straight line,the component positioning device is provided with a component mounting position, the auxiliary material feeding device is arranged on the longitudinal front side of the component mounting position ofthe component positioning device, and the auxiliary material sucking and mounting device is arranged above the component positioning device and the auxiliary material feeding device.

Description

technical field [0001] The invention relates to the field of automation equipment, in particular to a fully automatic placement system for braided sheet electronic components. Background technique [0002] After the packaging and testing of chip electronic components is completed, the electronic components are put into the orderly arranged carrier tape pockets through the tape equipment, then sealed with the cover tape, and then wound into the plastic reel, and finally the subsequent surface of the electronic components is carried out. mount. With the continuous promotion and popularization of automated production, the taping equipment of chip electronic components has basically realized full automation, but most of the surface mount operations are still manual placement, which not only has low placement efficiency but also poor placement quality. Stablize. Contents of the invention [0003] In view of the above problems, the present invention provides a fully automatic ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B15/04
CPCB65B15/04
Inventor 翟金双祁大伟
Owner SUZHOU WISETECH AUTOMATION TECH CO LTD
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