Numerical control polishing method for sapphire wafer for LED based on high-ratio polishing solution

Abstract

The invention discloses a numerical control polishing method for a sapphire wafer for an LED based on a high-ratio polishing solution. The method comprises the following steps that 1, the high-ratio polishing solution is prepared and serves as a polishing solution fresh material; 2, circular polishing is adopted for grinding and polishing the surface of the sapphire wafer; 3, the remaining polishing solution generated by one-time circular grinding and polishing is recovered and treated to serve as a polishing solution old material; and 4, in the circular grinding and polishing process of the next time, the polishing solution old material is added to supplement the solution according to the volatilization amount of the polishing solution fresh material. The high-ratio solution comprises polishing stock solution and water, the high-ratio polishing solution is obtained by uniformly mixing the polishing stock solution and the water according to the volume ratio of 1:n, and the value rangeof n is 1-3. According to the technical scheme, the method solves the problems that a present method for polishing the sapphire wafer for the LED is high in single-wafer polishing cost, the crystallization degree is high, and cleaning and sweeping are not easy.

Description

technical field [0001] The invention relates to the technical field of polishing sapphire wafers for LEDs, in particular to a numerically controlled polishing method for sapphire wafers for LEDs based on a high-proportion polishing liquid. Background technique [0002] Sapphire α-Al2O3 single crystal has excellent optical, mechanical, thermal, dielectric, corrosion resistance and other properties. With the continuous increase of market competition, how to produce products with more suitable performance and price can seize the market opportunity. Therefore, while ensuring the quality, the cost advantage is particularly important. In order to control the processing cost, it is necessary to continuously optimize and improve the raw materials and auxiliary materials. For polishing, the cost of polishing liquid is the highest item. How to reduce the use of polishing liquid Cost has become a difficult problem that must be overcome; [0003] At present, the polishing liquid used f...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for polishing sapphire wafers for LEDs based on a high-proportion polishing liquid, which solves the problems that the current method for polishing sapphire wafers for LEDs makes the cost of single-chip polishing relatively high and the degree of crystallization is high, which makes it difficult to clean and clean.