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Storage expansion method, device, readable storage medium and system of main control memory

A technology of storage expansion and storage media, which is applied in the field of devices, storage media and systems, and storage expansion methods of main control memory, which can solve the problems of high cost and achieve the effect of improving data transfer efficiency

Active Publication Date: 2022-04-12
YEESTOR MICROELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to provide a storage expansion method of the main control memory, aiming at solving the technical problem of high cost in the prior art when the main control expands the memory

Method used

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  • Storage expansion method, device, readable storage medium and system of main control memory
  • Storage expansion method, device, readable storage medium and system of main control memory
  • Storage expansion method, device, readable storage medium and system of main control memory

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Embodiment Construction

[0026] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] The main solution of the embodiment of the present invention is: according to the data application requirements, confirm the space amount of the data application memory storage space corresponding to the data application requirements; according to the confirmed data application memory storage space space amount, and the Flash The size of the Buff capacity confirms the scrap flash corresponding to the target quantity, wherein the target scrap flash includes one or more; encapsulates the confirmed target scrap flash as a target extended flash, and calls the target extended flash through the preset scrap flash controller as The data application storage space.

[0028] Due to the way of the main control integrated DRAM in the storage scheme of the prior art, the cost of the DRAM itself is high when the memory is ex...

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Abstract

The invention discloses a storage expansion method of a main control memory, which includes: according to the data application requirements, confirming the amount of memory storage space corresponding to the data application requirements; according to the space amount of the data application memory storage space, confirming Set the number of target scrap flashes of the scrap flash controller, wherein the target scrap flashes include one or more; finally package the confirmed target scrap flashes as target extension flash, and call the target extension flash through the preset scrap flash controller Memory storage space is used as the data. The invention also discloses a storage expansion device of the main control memory, a readable storage medium and a system. The present invention encapsulates scrap Flash and Flash according to the current data storage requirements, and stores data and expands memory through the encapsulated Flash, thereby realizing the beneficial effect of improving application performance at the lowest cost.

Description

technical field [0001] The present invention relates to the technical field of storage expansion applications, in particular to a storage expansion method, device, storage medium and system for a main control memory. Background technique [0002] The size of the Buff (memory expansion) of the storage master has a great impact on the cost of the chip. The size of the design Buff is fixed after the chip is mass-produced. become a restrictive factor. When the existing technology solves the problem of the size of the Buff, a part of the data is stored in the Flash (flash memory), and dynamically read from the Flash to the Buff when it needs to be used, and the application of this method reduces the performance of the chip. In addition, if the storage master integrates other types of Cache (cache, such as DRAM) as a supplement to the buff to solve the problem of the size of the buff, the cost of the master chip will be greatly increased. [0003] The above content is only used ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/06
CPCG06F3/0608G06F3/0667G06F3/0679
Inventor 杨继光吴大畏李晓强
Owner YEESTOR MICROELECTRONICS CO LTD
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