Temperature sensing device and equipment

Abstract

The invention discloses a temperature sensing device and equipment. The device comprises the following parts: a temperature sensitive power source layer, provided on an electronic component of a circuit board, having a pyroelectric effect, and used for detecting the temperature of the electronic component in real time and generating a pyroelectric signal indicating the temperature; and a control chip, disposed on the circuit board, connected to the temperature sensitive power source layer, and used for determining the temperature indicated by the pyroelectric signal according to the pyroelectric characteristics of the temperature sensitive power source layer after receiving the pyroelectric signal. It can be seen that the application sets a temperature sensitive power source layer on the electronic component without changing the original characteristics of the electronic component, so that the space of the circuit board is not additionally occupied, and the setting flexibility is high.Moreover, the temperature sensing method provided by the application does not need to add more temperature sensing hardware compared with the prior art, thereby reducing the circuit complexity and design cost of the circuit board.

Description

technical field [0001] The invention relates to the technical field of temperature sensing, in particular to a temperature sensing device and equipment. Background technique [0002] For a server or a storage system, most of the electronic components contained therein are arranged on a circuit board. At present, in order to ensure the safety and reliability of the circuit structure on the circuit board, it is usually necessary to sense the temperature of different positions on the circuit board to prevent the circuit board from being burned due to overheating. In the prior art, usually a plurality of temperature sensing chips are added on the circuit board to sense the temperature of different positions on the circuit board respectively. However, this temperature sensing method will increase the circuit complexity and design cost of the circuit board; moreover, each temperature sensing chip includes a chip body and peripheral components of the chip body, which occupy more s...

AI Technical Summary

Problems solved by technology

However, this temperature sensing method will increase the circuit complexity and design cost of the circuit board; moreover, each temperature sensing chip includes a chip body and peripheral components of the chip body, which occupy more space on the circuit board, so When setting the temperature sensing chip, its setting position and setting number will be limited by the original circuit structure of the circuit board (that is, limited by the available space of the circuit board), resulting in low design flexibility

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