Prepreg lamination design method

Abstract

The invention relates to a prepreg lamination design method. The prepreg lamination design method comprises the steps: preserving an original external layer prepreg contacting or adjacent to a circuitlayer in a circuit board; and replacing the original intermediate layer prepreg with a new prepreg, wherein the thickness of a glass fiber layer in the single new prepreg is greater than the thickness of a glass fiber layer in the single original intermediate layer prepreg, and the thickness of the resin glue of the single new prepreg is less than the thickness of the resin paste of the single original intermediate layer prepreg. On the premise of not changing the thickness of the circuit board, the number of new prepregs used can be much less than the number of the original intermediate layer prepregs, thus effectively reducing or eliminating the risk of board sliding caused by excessive lamination during lamination operation, and guaranteeing the quality of the finished circuit board. Moreover, increase of the thickness of the glass fiber layer in the new prepreg effectively compensates for decrease of the thickness of the resin glue caused by the decrease of the number of the original intermediate layer prepregs, thus greatly reducing the use amount of the resin glue, thereby reducing the production cost of the circuit board and improving the operation economical efficiency ofthe circuit board supplier.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a prepreg laminate design method. Background technique [0002] With the continuous development of electronic and electrical products in the direction of intelligence, printed circuit boards are also moving towards multi-layer structures. Multilayer circuit boards generally use prepregs as the bonding medium between layers. However, the type and quantity of prepregs used will be affected by factors such as performance requirements, dielectric thickness, and residual copper ratio. [0003] In actual production, when encountering a thick copper circuit board (copper thickness ≥ 70 μm), especially a rear copper board with a low residual copper rate and a large copper-free area, a larger number of prepregs must be used between layers to meet the requirements. This will lead to two problems: one is that the number of prepregs increases, which means that the amount of r...

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Problems solved by technology

[0003] In actual production, when encountering a thick copper circuit board (copper thickness ≥ 70 μm), especially a rear copper board with a low residual copper rate and a large copper-free area, a larger number of prepregs must be used between layers to meet the requirements. This will lead to two problems: one is that the number of prepregs increases, which means that the amount of resin glue increases, which will lead to increased production costs; the other is that the number of prepregs increases, which can easily lead to lamination. The risk of slippery boards during operation will affect the board quality of the circuit board

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