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Ultraviolet LED packaging structures

A technology of LED packaging and LED chips, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of rising manufacturing costs, limited heat dissipation, lack of gas flow on the surface of LED chips, etc., so as to improve the service life and improve the overall performance , Eliminate the effect of reducing efficiency and life

Inactive Publication Date: 2019-03-08
CHANGSHU INSTITUTE OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This solution increases the manufacturing cost. At the same time, the upper light-transmitting hollow shell and the lower light-transmitting hollow shell are actually a closed space, and the surface of the LED chip lacks gas flow. Therefore, even if it is filled with high thermal conductivity gas, its heat dissipation effect still limited

Method used

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  • Ultraviolet LED packaging structures
  • Ultraviolet LED packaging structures
  • Ultraviolet LED packaging structures

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Please combine figure 1 As shown, the ultraviolet LED packaging structure involved in this embodiment includes a substrate 101 and a light-transmitting housing 102. The light-transmitting housing 102 is made of quartz glass, which can be a six-sided closed cuboid structure to form a closed space 107. Buckle, riveting, gluing and other combinations. In addition, the airtight space 107 can be formed by the transparent housing 102 and the substrate 101 , that is, a part of the substrate 101 protrudes from the transparent housing 102 , and the two are sealed and connected. A vacuum is formed in the above-mentioned closed space 107 . The substrate 101 is used to carry the circuit and the ultraviolet LED chip 103, and the emission wavelength of the ultraviolet LED chip 103 is 10-405nm. A printed circuit is provided on the substrate 101 , the ultraviolet LED chips 103 are electrically connected to the circuit, and all the ultraviolet LED chips 103 are located in the light-tr...

Embodiment 2

[0026] Example 2, please combine figure 2 and image 3 As shown, the ultraviolet LED packaging structure involved in this embodiment includes a substrate 201 and a light-transmitting housing 202. The light-transmitting housing 202 is made of soda-lime glass, and can be a closed space 207 formed by a cuboid structure with six sides closed. Combination by buckle, riveting, gluing, etc. In addition, the airtight space 207 can be formed by the light-transmitting casing 202 and the substrate 201 , that is, a part of the substrate 201 protrudes from the light-transmitting casing 202 , and the two are sealed and connected. The heat conduction gas is filled in the above-mentioned closed space 207 to enhance heat dissipation. The substrate 201 is used to carry the circuit and the ultraviolet LED chip 203, and the emission wavelength of the ultraviolet LED chip 203 is 10-405nm. A printed circuit is provided on the substrate 201 . The difference from the first embodiment is that the ...

Embodiment 3

[0027] Example 3, please combine Figure 4 As shown, the ultraviolet LED packaging structure involved in this embodiment includes a substrate 301 and a light-transmitting housing 302. The light-transmitting housing 302 is made of borosilicate glass. Combination by buckle, riveting, gluing, etc. In addition, the airtight space 307 can be formed by the light-transmitting casing 302 and the substrate 301 , that is, a part of the substrate 301 protrudes from the light-transmitting casing 302 , and the two are sealed and connected. The heat conduction gas is filled in the above-mentioned closed space 307 to enhance heat dissipation. The substrate 301 is used to carry the circuit and the ultraviolet LED chip 303, and the emission wavelength of the ultraviolet LED chip 303 is 10-405nm. A printed circuit is arranged on the substrate 301. The difference from Embodiment 1 is that the substrate 301 is made of a partially flexible material, and the substrate 301 is bent to form a plural...

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Abstract

The invention discloses ultraviolet LED packaging structures. A structure comprises a base plate and a light transmitting shell. A circuit is set on the base plate. Ultraviolet LED chips connected with the circuit are set on the base plate. The light transmitting shell forms an airtight space. The ultraviolet LED chips are located in the light transmitting shell. Insulation layers are set on a side of the base plate opposite to the ultraviolet LED chips. The insulation layers are adhered on the inner wall of the light transmitting shell through utilization of silver colloid. An electric connection contact is set out of the airtight space formed by the light transmitting shell. The electric connection contact is connected with the circuit. According to the structure, an organic packaging material is not employed; an aging problem of a packaging material is avoided; and the base plate and the light transmitting shell are adhered through utilization of the silver colloid, so heat of the chip can be transferred greatly, and heat dissipation performance of the chip can be improved. Service life and integrated performance of ultraviolet LEDs can be effectively improved.

Description

technical field [0001] The invention relates to an LED packaging structure, in particular to an ultraviolet LED packaging structure. Background technique [0002] Ultraviolet LEDs generally refer to LEDs with a central wavelength of light emission below 405nm. In the LED industry, light emission wavelengths between 355nm and 405nm are generally called near-ultraviolet LEDs, and those shorter than 300nm are called deep ultraviolet LEDs. According to more detailed bands and uses, UV LEDs can be divided into the following three categories: (1) UVA: the wavelength is between 315 and 405nm, mainly used for curing, medical treatment, printing, photolithography, banknote detection and photocatalysis, etc.; (2) ) UVB: The wavelength is between 280 and 315nm, mainly used for medical treatment, biological analysis (such as DNA), etc.; (3) UVC: The wavelength is less than 280nm, mainly used for sterilization (water, air purification) and component analysis. Compared with the tradition...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/60H01L33/64H01L25/075
CPCH01L25/0753H01L33/486H01L33/60H01L33/641
Inventor 王书昶付杰周合唐余虎况亚伟
Owner CHANGSHU INSTITUTE OF TECHNOLOGY
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