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Damping computer base with good heat dissipation effect

A technology of heat dissipation effect and computer, applied in the field of computer, can solve the problems of poor heat dissipation effect and many gaps, and achieve the effect of good heat dissipation effect, novel design and best heat dissipation effect

Active Publication Date: 2019-03-08
安徽正特机电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The mainframe of the computer is generally placed on the base of the mainframe. The existing base of the mainframe is equipped with a heat dissipation mechanism and a shock absorbing mechanism. However, the heat dissipation mechanism is generally installed at the lower end of the mainframe for heat dissipation due to the problem of plugging in the rear end of the mainframe, and the heat dissipation effect is poor. , there is the largest gap at the rear end of the main unit where the wires are plugged in, and the effect of introducing air from this place is the best, and the existing technology cannot complete it.

Method used

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  • Damping computer base with good heat dissipation effect
  • Damping computer base with good heat dissipation effect
  • Damping computer base with good heat dissipation effect

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Experimental program
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Effect test

Embodiment 1

[0023] see Figure 1~4 , in an embodiment of the present invention, a shock-absorbing computer base with good heat dissipation effect includes a heat dissipation plate 1, a bottom plate 2, a heat dissipation mechanism and a shock absorption mechanism; the heat dissipation plate 1 is hinged on the bottom plate 2, and the inner side of the bottom plate 2 is arranged There is a placement groove 11, the heat dissipation mechanism is arranged on the heat dissipation plate 1, and the shock absorption mechanism is arranged in the placement groove 11. The shock absorption mechanism includes a movable plate 15, a fixed plate 16 and a spring 17, and the fixed plate 16 is connected with a plurality of springs 17. The bottom plate 2 is connected, and the fixed plate 16 is slidably installed with a movable plate 15 for placing the main computer by a slide plate 22. The spring 17 provided with the fixed plate 16 and the movable plate 15 plays a shock-absorbing effect on the main computer. Th...

Embodiment 2

[0028] In order to increase the stability of the device without affecting the movement of the device, the present embodiment optimizes the bottom plate 2, the lower end of the bottom plate 2 is symmetrically equipped with legs 4, and the inner side of the legs 4 is provided with a two-way threaded rod 9, One end of the two-way threaded rod 9 is rotatably connected to the leg 4 , and the other end of the two-way threaded rod 9 runs through the other leg 4 and is fixedly connected to the turntable 5 . The rotation of the two-way threaded rod 9 can be realized by turning the turntable 5 .

[0029] The two-way threaded rod 9 is symmetrically sleeved with a threaded sleeve 8, and the threaded sleeve 8 is threadedly connected with the two-way threaded rod 9. The lower end of the threaded sleeve 8 is provided with a roller 7, and two rollers are installed on the rotating shaft of the roller 7 for symmetrical rotation. Connecting rod 6, two connecting rods 6 are respectively hinged wit...

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Abstract

The invention discloses a damping computer base with a good heat dissipation effect. The damping computer base comprises a heat dissipation plate, a bottom plate, a heat dissipation mechanism and a damping mechanism. The heat dissipation plate is hinged to the bottom plate. An accommodating groove is formed in the inner side of the bottom plate. The heat dissipation mechanism is arranged on the heat dissipation plate. The damping mechanism is arranged inside the accommodating groove. The damping mechanism comprises a movable plate, a fixed plate and springs. The fixed plate is connected with the bottom plate through the multiple springs. The movable plate used for storing a computer mainframe is mounted on the fixed plate in a sliding mode through a sliding plate. The damping computer baseis novel in design, the movable plate can be driven to move under the effect of T-shaped sliding blocks and T-shaped sliding grooves by pulling a baffle, accordingly, the computer mainframe can be pulled out conveniently for treatment such as wire plugging, meanwhile, sliding connection between the baffle and the movable plate does not affect up-down movement of the movable plate, the heat dissipation mechanism is located in the wire plugging position of the computer mainframe, the wire plugging position of the rear end of the computer mainframe has the most gaps, and the heat dissipation effect is the optimal if air is guided to the position.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a shock-absorbing computer base with good heat dissipation effect. Background technique [0002] A computer, commonly known as a computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical calculations, logical calculations, and has storage and memory functions. It is a modern intelligent electronic device that can run according to the program and process massive data automatically and at high speed. [0003] A computer is composed of a hardware system and a software system, and a computer without any software installed is called a bare metal. It can be divided into five categories: supercomputers, industrial control computers, network computers, personal computers, and embedded computers. More advanced computers include biological computers, photonic computers, and quantum computers. [0004] The host computer refers to the main...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16M11/04F16M11/38F16M11/42F16F15/04G06F1/18G06F1/20
CPCF16F15/04F16F2238/026F16M11/043F16M11/38F16M11/42G06F1/182G06F1/20
Inventor 刘申权
Owner 安徽正特机电科技有限公司
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