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Oriented-arrayed graphenemagnesium-base alloy with ultra-high thermal conductivity and preparation method and device

A technology of oriented alignment and magnesium-based alloys, applied in the field of materials, can solve the problems of reduced chemical activity and thermal conductivity, and achieve the effect of improving high thermal conductivity and chemical stability

Pending Publication Date: 2019-03-08
厦门十一维科技有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

In addition, due to the active chemical properties of magnesium, the surface will be slowly oxidized in the air, forming a dense oxide film and reducing thermal conductivity.
Therefore, whether it is possible for magnesium alloys to replace the widely used aluminum alloy radiators depends on whether the thermal conductivity of magnesium alloys can be improved and their chemical activity can be reduced.

Method used

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  • Oriented-arrayed graphenemagnesium-base alloy with ultra-high thermal conductivity and preparation method and device
  • Oriented-arrayed graphenemagnesium-base alloy with ultra-high thermal conductivity and preparation method and device

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Embodiment 1

[0043] The steps of preparing aligned graphene magnesium-based alloy are as follows:

[0044] Vacuum the high-temperature melting furnace first, and then fill the high-temperature furnace with argon gas after vacuuming to 1.5 Pa, put pure magnesium into the melting crucible, then raise the temperature in the high-temperature melting furnace to 735°C, and keep it for 1 hour. Add pure metals Zn, Sn, Al, Sr, graphene nanosheets and Mg-15wt% Mn, Mg-10wt% Ca alloy compounds preheated to 550°C into the pure magnesium melt. The mass percentage of each component in the melting crucible is: Zn is 2.5wt%, Sn is 3.5wt%, Ca is 0.5wt%, Sr is 1.0wt%, Al is 0.5wt%, Mn is 0.2wt%, and graphene is 3.5wt%. wt%, and the balance is pure magnesium. Stir and smelt and remove slag for 1 hour, and then stand still for 15 to 30 minutes, adjust the temperature of the graphene alloy melt to 700°C; set the magnetic field in the crucible area of ​​the casting furnace to 0.5T, and pour the evenly stirred a...

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Abstract

The invention belongs to the technical field of materials, and relates to an oriented-arrayed graphene magnesium-base alloy with ultra-high thermal conductivity and a preparation method and a preparation device. The oriented-arrayed graphene magnesium-base alloy is composed of magnesium alloy matrix and graphene nano-sheets arranged in the matrix, wherein the graphene nano-sheets are oriented-arranged in the matrix. The preparation method comprises the following steps that (1), the graphene, magnesium and alloy mixed with metal are mixed and smelted; and (2), a smelted graphene alloy body is cooled, heat preservation is conducted and a magnetic field is externally applied, and the inside graphene is oriented-arranged and is solidified to obtain the oriented-arrayed graphene magnesium-basealloy with ultra-high thermal conductivity. According to the oriented-arrayed graphene magnesium-base alloy, diamagnetism of the two-dimensional graphene is adopted, so that the graphene is oriented-arrayed in the magnesium alloy matrix, high thermal conductivity of the material is achieved, and chemical activity of the magnesium is reduced with the graphene.

Description

technical field [0001] The invention belongs to the technical field of materials, and relates to an oriented graphene material, in particular to an oriented-arranged graphene-magnesium-based alloy with ultrahigh thermal conductivity, a preparation method and a device. Background technique [0002] With the rapid development of modern industry, thermal management of heat dissipation components of equipment and improvement of heat dissipation performance of materials have gradually attracted attention. Magnesium alloy is currently the lightest metal structure material. Magnesium and magnesium alloys have better heat dissipation performance than resin and plastic products. They can be used to manufacture electronic products with dense components, or the shells and parts of electronic products, which can give full play to their heat dissipation advantages. The heat dissipation performance of its components has also received great attention. [0003] The thermal conductivity of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C23/00C22C23/04C22C32/00C22C1/10
CPCC22C1/1036C22C23/00C22C23/04C22C32/0084C22C1/1047
Inventor 李俊竺田博姜小川董豪聪王洪炜
Owner 厦门十一维科技有限公司
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