Circuit board with heat conduction structure, and fabrication method of circuit board

Abstract

The invention discloses a circuit board with a heat conduction structure. The circuit board comprises multiple layers of circuit boards, and is characterized in that at least one support body is mounted between every two adjacent layers of the circuit boards, so that a cavity is formed between the two layers of the circuit boards; the cavity is filled with a heat conduction medium; and the heat conduction medium and the support body form a heat conduction structure. According to the structure, heat dissipation of the circuit board is achieved through the heat conduction structure with a smallsize, so that lighting and thinning heat dissipation requirements of a small electronic device are met; and furthermore, the heat conduction structure is added without changing a circuit layout of theexisting circuit board, so that the design cost of the circuit board is not increased. The invention further discloses a fabrication method of the circuit board with the heat conduction structure. The fabrication method is simple to operate; and the fabricated circuit board has good heat dissipation characteristics.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a circuit board with a heat conduction structure and a manufacturing method thereof. Background technique [0002] Today, with the demand for thinner and lighter electronic equipment, electronic devices are becoming more and more miniaturized and integrated, and the structure of circuit boards is becoming more and more complex and compact. The high-density electronic devices and circuits have caused unavoidable heat dissipation problems. Especially for processing chips and high-power devices, if the heat cannot be conducted to the outside world in a timely and effective manner, the high temperature brought by it will seriously affect the performance of electronic equipment, and may cause abnormalities and damage to electronic equipment. Therefore, the heat dissipation of electronic equipment greatly affects product design and daily use. [0003] At pr...

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Problems solved by technology

[0006] However, in the multi-layer insulating and heat-dissipating circuit board published by the application publication number CN108012412A, the increase of structural parts will inevitably lead to the complexity of the circuit board structure and the increase in volume, making it difficult to apply to small and micro circuits, and also contrary to electronic equipment. In addition, due to the existence of the insulating layer, the lines between the line layers need to be avoided, resulting in dense line layout and increasing the difficulty of line design. At the same time, dense wiring will also affect signal transmission.

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