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Speaker housing and forming method thereof

A molding method and loudspeaker technology, applied to sensors, loudspeakers, electrical components, etc., can solve the problems of high cost, complex structure, and low production efficiency of silicone sleeve scrapping, achieve simple structure and molding process, and improve acoustic performance , Improve the effect of molding yield

Inactive Publication Date: 2019-02-12
GOERTEK INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the complex structure of the shell in the module, the yield rate of silicone molding is low; and the size of the shell body in the module is relatively large, and a set of molds cannot mold the silicone sleeves in batches at the same time, resulting in low production efficiency; The shell in the group contains multiple metal inserts that can achieve conduction, so the cost of scrapping the silicone sleeve after molding is relatively high

Method used

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  • Speaker housing and forming method thereof
  • Speaker housing and forming method thereof
  • Speaker housing and forming method thereof

Examples

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Embodiment Construction

[0034] In order to explain the present invention more clearly, various exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses. Techniques and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques and devices should be considered part of the description. In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment...

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Abstract

The invention discloses a speaker housing and a forming method thereof, and relates to the technical field of electroacoustic products. The speaker housing comprises a housing body and a connecting member, wherein the housing body is provided with an accommodating cavity; a sound hole for sound emission is formed in the housing body; the connecting member is fixedly coupled to the sound hole; theconnecting member comprises a body portion; a sound passageway communicating the sound hole with an external environment is formed in the body portion; the body portion comprises a protrusion portionprotruding from the surface of the housing body; the connecting member further comprises a silica gel sleeve formed on the outer wall of the protrusion portion in a manner of surrounding one circle ofthe body portion; and the silica gel sleeve and the body portion are of an integrated structure formed by an injection molding mode. According to the speaker housing provided by the invention, the connecting member of the integrated structure is formed by injection molding at first, and then the connecting member is fixedly coupled to the speaker housing, so that the forming yield of the silica gel sleeve on the housing can be significantly improved.

Description

technical field [0001] The invention relates to the technical field of electroacoustic products. More specifically, it relates to a loudspeaker housing and a forming method thereof. Background technique [0002] Speakers are important acoustic components in portable electronic devices that convert electrical energy into sound energy. The loudspeaker can be in the form of a single loudspeaker, or in the form of a loudspeaker module. [0003] Taking the application of the speaker module in mobile phones as an example, in the prior art, the speaker module generally includes a housing and a speaker unit housed inside the housing, the speaker unit includes a vibration system and a magnetic circuit system, and the speaker module There is a front acoustic cavity and a rear acoustic cavity inside. The front acoustic cavity is jointly surrounded by the side of the housing facing the vibration system and the vibration system, and the rear acoustic cavity is jointly enclosed by the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R9/02H04R31/00
CPCH04R9/02H04R31/00H04R2231/003H04R2400/11
Inventor 毛林进
Owner GOERTEK INC
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