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Device that supports semiconductor device high temperature aging test

A high-temperature aging, semiconductor technology, applied in the direction of single semiconductor device testing, etc., can solve the problem that the aging test device is difficult to apply high-temperature and high-speed semiconductor testing, etc., to improve the test signal integrity, reduce the possibility of device instability, and reduce construction costs. Effect

Pending Publication Date: 2019-01-29
武汉精鸿电子技术有限公司
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present application solves the problem that the aging test device in the prior art is difficult to apply to high-temperature and high-speed semiconductor testing by providing a device that supports high-temperature aging testing of semiconductor devices

Method used

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  • Device that supports semiconductor device high temperature aging test
  • Device that supports semiconductor device high temperature aging test
  • Device that supports semiconductor device high temperature aging test

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Embodiment Construction

[0021] In order to better understand the above-mentioned technical solution, the above-mentioned technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0022] This embodiment provides a device for supporting high-temperature aging tests of semiconductor devices, such as Figure 2-Figure 4 As shown, it includes: a unit under test and a backboard, the unit under test is connected to the backboard, and both the unit under test and the backboard are placed in a high temperature box during the test.

[0023] Wherein, a first air pipe and a second air pipe are arranged on the back plate.

[0024] The unit under test includes a PCB board, an ATE single board, a DUT, and a heat insulation cavity; the DUT is located on the top surface of the PCB board, and the ATE single board is connected to the bottom surface of the PCB board, that is, the DUT The back-to-back connection with the ATE single board is a...

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Abstract

The invention belongs to the semiconductor aging test technical field, and discloses a device that supports a semiconductor device high temperature aging test; the device comprises a tested unit, anda back plate; the tested unit is connected with the back plate, and placed in a high temperature box; a first gas tube and a second gas tube are arranged on the back plate; the tested unit comprises aPCB plate, an ATE single plate, a DUT, and a heat insulation cavity; the DUT is arranged on top of the PCB plate; the ATE single plate is connected with the bottom of the PCB plate; the heat insulation cavity is connected with the bottom of the PCB plate; the ATE single plate is arranged in the heat insulation cavity; the heat insulation cavity is provided with a gas inlet and a gas outlet; the gas inlet is jointed with the first gas tube; the gas outlet is jointed with the second gas tube. The device can solve the problems that an existing aging test device cannot be applied to a high temperature high speed semiconductor test.

Description

technical field [0001] The invention relates to the technical field of semiconductor aging testing, in particular to a device supporting high temperature aging testing of semiconductor devices. Background technique [0002] In the TDBI system of semiconductors, different temperature test ranges are divided for device specification grades. The temperature range of commercial-grade devices is 0-70°C, the temperature range of industrial-grade devices is -40-+85°C, the high temperature of automotive-grade devices can reach 105-125°C, and the high temperature of military and aerospace-grade devices can reach 150°C. For ultra-high temperature (>105°C) semiconductor testing scenarios, we need to find a more reliable and lower-cost solution. At the same time, in the research and development process of semiconductors, ultra-high temperature testing is also required in the laboratory environment to evaluate the reliability of the current manufacturing process and process, and a te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26
CPCG01R31/26
Inventor 裴敬杜建邓标华
Owner 武汉精鸿电子技术有限公司
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