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Photosensitive resin composition

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve the problems of not obtaining high-definition line shape, not obtaining coating film appearance, insufficient coating film sensitivity, etc., and achieving excellent coating film appearance and Insulation properties, excellent clarity, excellent appearance effect

Active Publication Date: 2019-01-22
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, if the photosensitive resin composition as the raw material of the insulating protective film is coated thickly as in Patent Document 1, the ultraviolet light is difficult to reach the deep part of the coating film due to the thickness of the coating film, so the thickness of the coating film The sensitivity (especially the sensitivity near the bottom of the coating film) is not sufficient, and there are problems that high definition (high dimensional accuracy) and good line shape may not be obtained
However, if the photosensitive resin composition is applied thickly as described above by the spray coating method, there is a problem of sagging in the coating film and a problem that a good coating appearance cannot be obtained.

Method used

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  • Photosensitive resin composition
  • Photosensitive resin composition

Examples

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Comparison scheme
Effect test

Embodiment 1～8、 comparative example 1～7

[0094] Mix the components shown in the following Tables 1 and 2 at the ratios shown in the following Tables 1 and 2, and mix and disperse them at room temperature using a triple roller to prepare the compounds in Examples 1 to 8 and Comparative Examples 1 to 7. The photosensitive resin composition used. Then, the prepared photosensitive resin composition was apply|coated as follows, and the test piece was produced. The numbers in the following Tables 1 and 2 represent parts by mass. In addition, blank columns in the following Tables 1 and 2 indicate that they were not mixed.

[0095] [Table 1]

[0096]

[0097] [Table 2]

[0098]

[0099] In addition, the details about each component in Tables 1 and 2 are as follows.

[0100] (A) Carboxyl group-containing photosensitive resin of component

[0101] In 250 parts by mass of carbitol acetate, 220 parts by mass of cresol novolac epoxy resin (manufactured by Sumitomo Chemical Industries, Ltd., ESCN-220, epoxy equivalent w...

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Abstract

The invention provides a photosensitive resin composition, which is obtained by a sparing method. The photosensitive resin composition is thick, has excellent sensitivity, is resistant to edge subside, and can form a cured coating with excellent appearance, high definition (high size precision), and insulation property. The photosensitive resin composition comprises (A) carboxyl containing photosensitive resin; (B) a photo-polymerization initiator; (C) a reactive diluent; (D) an epoxy compound; (E) bentonite processed by quaternary ammonium salt, which is represented by formula (I): [R1R2R3R4-N]+X-; (F) hydrophobic silicon dioxide; and (G) coloring pigment other than phthalocyanine green; and for each 100 parts by mass of (A) carboxyl containing photosensitive resin, there is 5.0 to 20 parts by mass of (F) hydrophobic silicon dioxide.

Description

technical field [0001] The present invention relates to a photosensitive resin composition suitable for a covering material, for example, a covering material for covering a conductive circuit pattern formed on a substrate such as a printed circuit board, a cured product obtained by curing the same, and a printed circuit coated with the cured product plate. Background technique [0002] In order to form a conductive circuit pattern on the substrate and mount electronic components on the solder pads of the pattern by soldering, use printed circuit boards such as flexible printed circuit boards and rigid circuit boards, and protect the circuit parts other than the solder pads with insulation film (such as solder mask) coating. Therefore, when soldering electronic components on a printed circuit board, solder is prevented from adhering to unnecessary parts, and at the same time, circuit conductors are prevented from being corroded due to oxidation and humidity when they are dir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/004G03F7/09
CPCG03F7/004G03F7/027G03F7/09
Inventor 横田晃司轻部彰彦泉本大辅佐原武司
Owner TAMURA KK
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