Fixture and etching method for one-sided area etching

Abstract

The invention relates to a fixture and an etching method for one-sided area etching. The fixture comprises an upper part of the fixture, an upper end of the fixture is open, and a bottom part is provided with a through hole; A slide is positioned below the upper part of the jig; An O-ring group positioned between the upper part of the jig and the carrier sheet and positioned below the through hole; The O-ring group comprises an outer O-ring for preventing the external water bath solution from entering and an inner O-ring for placing an etched chip inside the O-ring group and preventing the etching liquid from etching out; A clamping device for clamping the upper part of the clamping device and the carrier sheet. Further may include a pressure balancing ring, a magnetic rotor, a surface protective film, and the like. The invention realizes the single-side corrosion facing upward, facilitates the discharge of corrosion gas, can carry out reliable corrosion on part of the single-side areaof the chip, protects other areas from being affected, and can be stable and reliable under the condition of corrosion penetration.

Description

technical field [0001] The invention belongs to the field of corrosion fixtures, and in particular relates to a stable and reliable corrosion fixing fixture for reliably corroding a partial area of ​​a single side of a chip, protecting other areas from being affected, and corrosion penetration conditions, and an etching method using the fixture. Background technique [0002] Wet etching of semiconductor chips is an indispensable basic process in microelectronics technology. Among them, wet etching of bulk silicon materials on chip substrates is one of the commonly used methods in MEMS technology. released from the silicon substrate. Etching includes etching the surface material and releasing the structure on the other side of the chip by etching through. In the field of scientific research, transparent nanoscale thin film materials can be obtained by using corrosion breakthrough release films, which is convenient for studying the mechanical, optical, and electronic properti...

AI Technical Summary

Problems solved by technology

[0005] 1) Patent CN104201135A discloses an etching fixture, which is characterized in that it uses vacuum to fix the chip for single-sided etching. The problem with this fixture is that it is not suitable for corrosion through corrosion, and negative pressure is easy to damage the film.

[0006] 2) Patent CN104986721B discloses a corrosion fixture, which is characterized by using deionized water to protect the protective surface. The disadvantage of this fixture is that it is the same as many previous chip inversion corrosion patents (such as US4165252, CN1477231A, CN105220143, etc.), facing Bubbles generated during corrosion are difficult to discharge in time. They can hardly be discharged after deep corrosion. It is not suitable for deep corrosion or even corrosion penetration of silicon corrosion liquid such as KOH.

In addition, after the corrosion breakthrough of this device, once the film is broken, the exchange of the corrosion liquid and the protection liquid will damage the protected area, which is not applicable to the corrosion situation of corrosion breakthrough.

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