High-level, thick cop thin-core board laminating type method and PCB board

Abstract

A high-level, thick copper thin-core plate laminating type method and PCB board are disclosed. A laminating type is formed on the upper and lower surfaces of a laminated plate to be laminated before being laminated. The laminating type material is stacked first, and then the laminated plate to be laminated is placed on the laminating type material, and then the laminating type material is placed on the laminated plate to be laminated. The invention ensures the fixity between different layers of the pressing plate, avoids the deviation of the skateboard layer, improves the alignment precision between the layers, improves the yield, reduces the pressing times, shortens the production cycle and the production cost, and has the advantages of wide material selection, low cost and simple manufacture.

Description

technical field [0001] The invention relates to the technical field of PCB manufacturing, in particular to a high-level, thick-copper-thin-core board lamination method and a PCB board. Background technique [0002] With the rapid development of science and technology, various electronic products are widely used, requiring smaller and thinner volumes, so the process requirements for printed circuit boards (PCBs) are getting higher and higher, and various components and interfaces The density is getting higher and higher, so it has become a development trend to use high-level, high-alignment precision laminated boards in the production process of PCBs. [0003] For this kind of high-level PCB, there are more prepregs per laminate, not less than 5 sheets. At the same time, the copper thickness of the core board is thicker, while the core board is thinner, so there is a certain degree of difficulty in lamination. To ensure no layer deviation and high alignment accuracy requirem...

AI Technical Summary

Problems solved by technology

[0003] For this kind of high-level PCB, there are more prepregs per laminate, not less than 5 sheets. At the same time, the copper thickness of the core board is thicker, while the core board is thinner, so there is a certain difficulty in lamination. It is necessary to ensure that the glue between the lines is fully filled and at the same time It is necessary to ensure no layer deviation and high alignment accuracy, so the risk of layer deviation of the slide plate is likely to occur under the action of high temperature and high pressure during the pressing process, the pass rate is low, and the production cost is high, which also affects the production schedule and cycle

[0004] In order to meet PCB quality requirements, PCB manufacturers need to develop new process capabilities to meet market and quality requirements. For products designed with high-level, no less than 5 prepregs between layers, and thick copper and thin core boards, PCB manufacturers currently use Multiple pressing methods are used to improve the layer deflection of the skateboard. In this way, the process is complicated, and the production cost becomes higher, the production cycle is longer, and it is time-consuming and laborious.

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