High-precision automatic FPC (Flexible Printed Circuit) binding equipment

Abstract

The invention provides high-precision automatic FPC (Flexible Printed Circuit) binding equipment, which comprises an upper stand, a lower stand and a UPS (Uninterrupted Power Supply), and is characterized by further comprising an ACF attaching mechanism, an FPC pre-pressing mechanism, an FPC pressing mechanism, an FPC loading platform mechanism and a four-shaft adjustable carrying platform mechanism, wherein the FPC pressing mechanism, the FPC pre-pressing mechanism and the ACF attaching mechanism are arranged on a horizontal working table of the lower stand in sequence; the FPC loading platform mechanism is connected with the ACF attaching mechanism; and the four-shaft adjustable carrying platform mechanism is arranged on the horizontal working table of the lower stand and located in front of the FPC pressing mechanism, the FPC pre-pressing mechanism and the ACF attaching mechanism. According to the high-precision automatic FPC binding equipment, the adjustable four-shaft carrying platform is used to transfer a liquid crystal glass substrate, and CCD (Charge Coupled Device) alignment realizes correction and compensation to reduce an FPC binding error; and only one operator loadingand unloading a material at the same station can complete the whole binding process, so that the uncertainty caused by manual operation is greatly reduced, and the binding precision of a product is greatly improved.

Description

technical field [0001] The invention relates to the field of LCM liquid crystal module production equipment, in particular to a high-precision automatic FPC binding equipment. Background technique [0002] In the LCM liquid crystal module production process, the FPC binding process involves ACF attachment, FPC loading, FPC and liquid crystal glass substrate alignment pre-pressing, and FPC local pressure curing. [0003] Among the existing semi-automatic equipment, the FPC binding process is divided into two equipment to complete, one for ACF attachment, and one for FPC pre-pressing and local pressing, so at least two operators are required to complete the entire binding In addition, it is necessary to manually transfer the attached product to another device, which increases the risk of scratching and damage to the product during the manufacturing process, and virtually increases the cost. At the same time, the two devices need to be manually aligned separately, and there is...

AI Technical Summary

Problems solved by technology

[0003] Among the existing semi-automatic equipment, the FPC binding process is divided into two equipment to complete, one for ACF attachment, and one for FPC pre-pressing and local pressing, so at least two operators are required to complete the entire binding process, and it is necessary to manually transfer the attached product to another device, which increases the risk of scratching and damage to the product during the manufacturing process, and virtually increases the cost

At the same time, the two devices need to be manually aligned separately, and there is no compensation mechanism, so the alignment accuracy cannot be guaranteed, which greatly increases the defective rate of the product

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