Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A rapidio-based high-speed communication method between SoC chips

An inter-chip high-speed, inter-chip technology, applied in the field of communication, can solve the problems of difficulty in increasing the speed of parallel communication mode and high cost, and achieve the effect of meeting the needs of real-time processing of large data volumes

Active Publication Date: 2020-04-03
BEIJING INST OF REMOTE SENSING EQUIP
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method of high-speed communication between SoC chips of the system based on RapidIO, to solve the problem that the speed of parallel communication mode is difficult to improve and the cost is high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A rapidio-based high-speed communication method between SoC chips

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] The concrete steps of a kind of high-speed communication method between SoC chips of the missile system based on RapidIO are as follows:

[0032] The first step is to build a chip-to-end device that supports the RapidIO interface on the SoC chip of the missile system

[0033] The SoC chip of the missile system supports the chip-to-end device of the RapidIO interface, including: one or more SoC chips with the RapidIO interface, and one or more processors with the RapidIO interface, such as DSP or FPGA.

[0034] SoC chip with RapidIO interface: SoC multi-functional integrated chip with multi-core CPU processor, on-chip memory, and acceleration module. The integrated chip has RapidIO high-speed interface, supports six transmission rates and four communication modes, and can generate and receive Various data between SoC chips.

[0035] Processor with RapidIO interface: The missile system generally contains a variety of processors, which are responsible for different functi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a RapidIO-based high-speed communication method between SoC chips of an on-board system. Six transfer rates are included, based on a RapidIO 3.1 communication protocol, according to market demands, the RapidIO interface of SoC chips is configured with four transfer modes: an AXI bus mode, a DMA transfer mode, a DME transfer mode, and a doorbell mode. The communication method designs an automatic transmission method, according to the amount of data to be transmitted and destination address basic information, the most efficient transfer mode is selected from four transfermodes automatically, that transmission bandwidth is fully utilized, the problem of high speed communication between SoC chips and other connected chip-to-terminal equipment in missile guidance systemis solved, and the requirements of large data volume and small data volume are met. The transmission rate can reach 10.3125 Gbps, and the utilization ratio of transmission bandwidth can be increasedfrom 30% to 52%. The method is suitable for most hardware transmission interfaces on the market.

Description

technical field [0001] The invention relates to a communication method, in particular to a RapidIO-based high-speed communication method between SoC chips of an on-board system. Background technique [0002] Missile-guided high-performance embedded signal processing system has the characteristics of frequent communication between chips and boards, large amount of data, and high real-time performance. In a missile system with multi-core processing, the transmission rate between chips directly affects the internal information and data interaction of the missile, so high-speed transmission between chips is very important. [0003] Missile systems usually require real-time processing of a large amount of image data, and a single processor cannot meet the high-speed real-time processing requirements of large amounts of data. At present, the distributed parallel processing method is widely used in the field of high-speed real-time signal processing. At this time, the transmission...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F13/20G06F13/28
CPCG06F13/20G06F13/28G06F2213/0038
Inventor 李欣致刘志哲马承光
Owner BEIJING INST OF REMOTE SENSING EQUIP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com