Modified hexagonal boron nitride as well as preparation method and application thereof

A technology of hexagonal boron nitride and modification, which is applied in the field of modified hexagonal boron nitride and its preparation, can solve the problems of reduced dispersibility and reduced thermal conductivity of modified hexagonal boron nitride, and can reduce thickness and improve thermal conductivity. , improve the effect of improving efficiency

Active Publication Date: 2019-01-08
SHENZHEN INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the present invention, after omitting the high thermal conductivity material (silver) and reducing the thickness of the cladding layer, there is no known prediction by those skilled in the art that omitting silver will cause a reduction in thermal conductivity and reducing the thickness of the cladding layer will Cause the problem that the dispersibility of modified hexagonal boron nitride in the material decreases, but the modified hexagonal boron nitride provided by the present invention can be uniformly dispersed in the polyvinyl alcohol substrate and increase the thermal conductivity of polyvinyl alcohol

Method used

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  • Modified hexagonal boron nitride as well as preparation method and application thereof
  • Modified hexagonal boron nitride as well as preparation method and application thereof

Examples

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Embodiment 1

[0044] A heat-conducting polyvinyl alcohol composite material, wherein the volume ratio of modified hexagonal boron nitride and polyvinyl alcohol is 1:4.

[0045] The preparation method is as follows:

[0046] (1) Mix hexagonal boron nitride and polyethyleneimine at a mass ratio of 9:1, and add a mixed solvent formed by deionized water and absolute ethanol at a mass ratio of 5:3, and continue magnetic stirring after ultrasonic stirring for 2 hours 24h, obtain the preliminary product of modified hexagonal boron nitride;

[0047] (2) Centrifuge the preliminary product of modified hexagonal boron nitride obtained in step (1) at a centrifugal rate of 2500 rpm, wash and remove polyethyleneimine not coated on the surface of hexagonal boron nitride, and then dry it at 50°C to obtain Modified hexagonal boron nitride;

[0048] (3) Magnetically stir the formulated amount of polyvinyl alcohol, modified hexagonal boron nitride and deionized water at 65°C for 4 hours, then defoam, coat a...

Embodiment 2

[0051] The only difference from Example 1 is that in step (1), the mass ratio of hexagonal boron nitride and polyethyleneimine is 10:1.

Embodiment 3-6

[0053] The only difference with Example 1 is that in step (1), the solvent is a mixed solvent (Example 3) formed by deionized water and absolute ethanol with a mass ratio of 4:3, and the solvent is deionized water and anhydrous Ethanol is the mixed solvent (embodiment 4) that 6:3 forms with mass ratio, and solvent is the mixed solvent (embodiment 5) that deionized water and absolute ethanol form with mass ratio as 1:1, and solvent is deionized water and The mixed solvent (embodiment 6) that absolute ethanol is formed as 7:3 with mass ratio.

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Abstract

The invention provides modified hexagonal boron nitride as well as a preparation method and application thereof. The modified hexagonal boron nitride is prepared from polyethyleneimine as a coating layer, wherein t he thickness of the coating layer of the modified hexagonal boron nitride is 4-6nm. The modified hexagonal boron nitride provided by the invention has very good heat conductivity, and has good dispersibility in a polymer substrate.

Description

technical field [0001] The invention belongs to the field of modified materials, and relates to a modified hexagonal boron nitride and its preparation method and application. Background technique [0002] For more than half a century, electronic components have been developing toward miniaturization and multi-functionality. The increase in power density and the reduction in feature size make the heat generated by electronic components accumulate rapidly, and the temperature of electronic equipment increases accordingly. The temperature will affect the normal operation of the equipment and reduce the service life of the equipment. Therefore, it is necessary to develop a new type of high thermal conductivity composite material to dissipate the heat generated by the operation of electronic equipment. [0003] Polymer materials are often used as packaging materials for electronic components and integrated circuits because of their advantages of easy processing, high mechanical ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K9/10C08K3/38C08L29/04C09K5/14
CPCC08K3/38C08K9/10C08K2003/385C09K5/14C08L29/04
Inventor 朱朋莉黎华源李刚赵涛孙蓉
Owner SHENZHEN INST OF ADVANCED TECH
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