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Detachment device

A technology of peeling device and protective film, which is used in transportation and packaging, thin material processing, electrical components, etc., can solve the problems of insufficient amount of adhesive and inability to have adhesive force, and achieve the effect of true peeling

Active Publication Date: 2019-01-04
SHINKAWA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are problems as follows: in the case of a small chip for mobile use, it is difficult to apply an appropriate amount of adhesive, and the adhesive will be exposed from the chip, or in the case of a large chip for large-capacity applications, Conversely, the amount of adhesive is insufficient, etc. to have sufficient adhesive force

Method used

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Experimental program
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Embodiment Construction

[0029] Hereinafter, the structure of the peeling device will be described with reference to the drawings. figure 1 It is a schematic structural diagram of the peeling apparatus 10 of a protective film. figure 2 It is a schematic diagram showing the shapes of the collet 16 and the workpiece 102 . and, image 3 It is a side view showing the peeling state of the protective film 100, Figure 4 yes image 3 A partial enlargement of the .

[0030] The peeling device 10 is a device that peels the protective film 100 from the adhesive member (DAF 104 ) attached to the workpiece 102 . The workpiece 102 is, for example, a semiconductor chip mounted on a substrate 110 . On the surface of the workpiece 102, a DAF 104 is adhered as an adhesive member. The DAF 104 is a film having a function as a die attach agent (adhesive) as is well known, and the DAF 104 is heated and hardened to bond the semiconductor chip. Typically, such a DAF 104 is laminated on the backside of a semiconducto...

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Abstract

This detachment device is provided with: a collet 16 including a contact surface 30 that comes into surface contact with a surface of a protective film 100 adhering to an adhesion member (DAF 104) attached on a workpiece 102, and including a suction hole 32 that is provided in the contact surface 30 and that suctions the protective film 100; and a movement mechanism that moves the collet 16 relative to the workpiece 102, wherein while the protective film 100 is being sucked by the suction hole 32, the collet 16 is separated from the workpiece 102 so that the protective film 100 is detached from the adhesion member (DAF 104). Accordingly, the detachment device capable of more assuredly detaching the protective film from the workpiece is provided.

Description

technical field [0001] This specification discloses a peeling device that peels a protective film protecting the surface of an adhesive member from an adhesive member adhered to a work. Background technique [0002] In recent years, miniaturization and high precision of electronic workpieces such as semiconductor elements have progressed in response to higher functionality of battery devices and expansion of mobile applications. In this case, fine contamination of the workpiece surface also becomes a problem, so in recent years, the surface of the workpiece is sometimes protected with a protective film until immediately before use. Especially when an adhesive member, for example, a Die Attach Film (DAF) is attached to the workpiece, the surface of the adhesive member is protected by a protective film. [0003] For example, in a die bonding process, a semiconductor chip (chip) is bonded to a lead frame or a substrate via a die attach agent such as a liquid epoxy resin adhesi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683B65H41/00H01L21/52
CPCH01L21/52H01L21/683B65H29/56B65H29/241B32B43/006H01L21/67092H01L21/67132B65H41/00
Inventor 柴原拓洋中村智宣瀬山耕平
Owner SHINKAWA CO LTD
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