SOQ-based flexible lever amplification vibration beam accelerometer chip, and processing technology thereof

Abstract

The invention provides an SOQ-based flexible lever amplification vibration beam accelerometer chip, and a processing technology thereof. The SOQ-based flexible lever amplification vibration beam accelerometer chip comprises a quartz structure and a silicon-based structure, which are bonded together, wherein the quartz structure is a same plane differential quartz vibration beam chip structure composed of a quartz frame, an inertia force input end, a flexible lever, a quartz tuning fork, a flexible hinge, a mass block, a connecting rod and an etching gap; the silicon-based structure comprises asilicon-based frame and a release groove; the processing technology comprises: firstly, processing the release groove of the silicon-based structure of a silicon wafer, bonding the silicon wafer witha quartz plate, then thinning and polishing the quartz plate to fabricate the quartz structure, and finally scribing by using a scribing machine; an inertia force generated by the mass block under the influence of acceleration is transferred onto the lever by the inertia force input end for amplification, the force is concentrated by the connecting rod and is uniformly distributed to two vibration beams of the quartz tuning fork, the tension frequency of the quartz tuning fork on both sides of central symmetry is increased, the compression frequency of the other side is reduced, and the acceleration is measured by the frequency difference change; and the chip provided by the invention has the advantages of small volume, high precision, etc.

Description

technical field [0001] The invention belongs to the technical field of micromechanical electronics (MEMS) digital accelerometers, and in particular relates to a SOQ (silicon on quartz)-based flexible lever amplified vibrating beam accelerometer chip and a processing technology thereof. Background technique [0002] There are two main problems in traditional quartz processing. Due to the high hardness of quartz, the etching options are relatively small, and most of the commercialized quartz wafers produced by the existing technology are relatively thick, generally more than 100um. Etching is difficult to etch through on one side, and the etching time is long and the etching cost is high; while the traditional wet etching has problems such as low etching accuracy, difficulty in etching small structures, and greater harm to the human body by the corrosive liquid. Therefore, most of the current quartz resonator devices are assembled with heterogeneous structures, that is, the se...

AI Technical Summary

Problems solved by technology

[0002] There are two main problems in traditional quartz processing. Due to the high hardness of quartz, the etching options are relatively small, and most of the commercialized quartz wafers produced by the existing technology are relatively thick, generally more than 100um. Etching is difficult to etch through on one side, and the etching time is long, and the etching cost is high; while the traditional wet etching has problems such as low etching accuracy, difficulty in etching small structures, and greater harm to the human body by the corrosive liquid.

Therefore, most of the current quartz resonator devices are assembled with heterogeneous structures, that is, the sensitive structure is made of quartz materials, and other parts are made of easy-to-process materials such as silicon or metal, which are assembled together after processing separately. Although this method reduces the difficulty of processing , but this will increase the difficulty of assembly, bring assembly errors, and lead to a decrease in the accuracy and sensitivity of the structure

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