A flexible board for easily assembling a circuit board and an assembly fixture thereof

Abstract

The invention relates to a flexible board for easily assembling a circuit board and an assembling fixture thereof, The flexible board comprises a flexible board body, A main via region and a standardpad region are arrange on the flexible board body, a group of electrical networks correspond to the electrical networks of optical device pins to be fabricated or tested is arranged in the main via region, and a group of standard pads correspond to the electrical networks of the main via are arranged in the standard pad region. The flexible board body further comprises a test pad region, wherein the test pad region is arranged between the main via region and the standard pad region; A set of test pads corresponding to the standard pad electrical network is provided in the test pad area. The invention has the beneficial effects that by increasing the docking tolerance between the pad of the circuit board and the test pad, the poor docking or even misalignment of the pad of the flexible softboard and the circuit board is not easy to occur when the test is carried out, so that the reliability and the yield of the optical device in the test process are improved.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a flexible soft board which is easy to assemble a circuit board and an assembly fixture thereof. Background technique [0002] Flexible board not only has excellent mechanical properties, but also has excellent electrical properties. Flexible boards can be moved, bent, and twisted without damaging the wires, and can have different shapes and special package sizes. Today, as the transmission rate of optical communication is getting higher and higher, the traditional product design can no longer meet the needs of high-speed signal transmission. In low-speed applications, the flexible board mainly plays the role of a connection, while in high-speed applications, the quality of high-speed signal transmission must be paid attention to. Therefore, when we design a flexible board, the distribution and routing of high-speed signal pads are very important. Appears to be pa...

AI Technical Summary

Problems solved by technology

The high-speed signal pads on the existing flexible board circuit are designed in a row. Due to the concentrated stress at the soldering point, the line of the high-speed signal pad is easy to break, and the corresponding high-speed signal line of the motherboard is difficult to achieve equal length, reducing signal integrity

[0003] And because the flexibility of multi-layer boards is much lower than that of single-layer boards, in the multi-process production and testing of optoelectronic devices and modules, repeated positioning and assembly will cause damage to flexible boards, which not only affects appearance, but also affects performance, leading to the use of flexible boards. Board products must be replaced with new flexible boards at high temperatures before they are sold. During the high temperature replacement process, it is easy to cause damage to the product again and cause it to fail.

Due to the above defects in flexible boards with high-density pads and their press-fitting methods, optoelectronic devices and communication modules are damaged or fail during the manufacturing and testing process, and the defect rate increases

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